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Circuit Card Assembly Fabrication and Assembly

Open
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract, issued by the Department of Defense through SPRMM1 DLA Mechanicsburg, involves the full manufacture and assembly of two tested Circuit Card Assemblies. The project requires strict adherence to TDP Version No. 011 for component integration, utilizing MIL-STD-1686C for ESD control and MIL-STD-130 for marking. The contractor must maintain ESD-safe environments and ensure all materials used are mercury-free. Additionally, all work must comply with DLATERMM11 approved supplier standards. The solicitation was posted on November 5, 2026, with a response deadline of December 7, 2026, under NAICS code 334412.

General Info

NAICS

334412 - Bare Printed Circuit Board Manufacturing

Place of Performance

PA, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRMM127QKA72.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

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CIRCUIT CARD ASSEMB

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Organization & Contact Information

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AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Performs full manufacture and assembly of Circuit Card Assemblies for prime contractors on DLA Mechanicsburg projects. Integrates components onto boards per TDP Version No. 011 using MIL-STD-1686C ESD control and MIL-STD-130 marking. Requires ESD-safe environments and mercury-free materials. Adheres to DLATERMM11 approved supplier standards. Delivers two completed and tested Circuit Card Assemblies.

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