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Bare Printed Circuit Board (PCB) Supply

Open

Federal

Response Deadline12/07/2026, 03:30:00 PM EST

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract opportunity, issued by the Department of Defense through DLA Mechanicsburg, involves the supply of unpopulated, bare printed circuit boards for prime contractors under NIIN 017374655. The selected provider will be responsible for the etching, drilling, and plating of circuit board substrates in strict accordance with TDP Version 001. Qualified bidders must operate a specialized PCB fabrication facility and utilize military-grade electronics substrates and chemicals to ensure compliance with technical standards. The contract was posted on November 6, 2026, with a response deadline of December 7, 2026, falling under NAICS code 334413.

General Info

DoD subcontract for fabricating unpopulated printed circuit boards per TDP Version 001.

Agency

Department Of Defense → SPRMM1 DLA Mechanicsburg

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

PA, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRMM127QHA20.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB

AI Contract Breakdown

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Timeline

PostedNov 6

subcontract

Response DeadlineDec 7

Submission deadline

Response Deadline

12/07/2026, 03:30:00 PM ESTin about 1 month

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Organization & Contact Information

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AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg

Office AddressN/A

ContactsNo contact information available

Full Description

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Supplies unpopulated, bare printed circuit boards for prime contractors on DLA supply contracts for NIIN 017374655. Performs etching, drilling, and plating of the circuit board substrate based on TDP Version 001. Requires a PCB fabrication facility and military-grade electronics substrates and chemicals. Delivers bare printed circuit boards.

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