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Circuit Card Assembly Manufacturing

Open
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract, issued by the Department of Defense through DLA Mechanicsburg, involves the manufacture and assembly of two complete circuit card assemblies for NIIN 017374655. The selected provider must fabricate and assemble the cards according to TDP Version 001, ensuring all units undergo proper physical identification and marking. Strict adherence to technical standards is required, including the implementation of ESD control programs within protected work areas compliant with ANSI/ESD S20.20. Additionally, the contractor must ensure full compliance with MIL-STD-130 REV N and MIL-STD-2073. The response deadline for this opportunity is December 7, 2026.

General Info

DoD subcontract for manufacturing two circuit card assemblies due by December 7, 2026.

NAICS

334412 - Bare Printed Circuit Board Manufacturing

Place of Performance

PA, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRMM127QHA20.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Manufactures and assembles complete circuit card assemblies for prime contractors on DLA supply contracts, specifically NIIN 017374655. Fabricates and assembles cards per TDP Version 001, implements ESD control programs, and performs physical identification and marking. Requires ESD-protected work areas and compliance with ANSI/ESD S20.20, MIL-STD-130 REV N, and MIL-STD-2073. Delivers two completed Circuit Card Assemblies.

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