This Combined Synopsis/Solicitation opportunity from Department Of Defense was posted on August 6, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Case Manufacturing
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
Active Opportunities Like This One
AI Contract Overview
The contract, issued by the Defense Microelectronics Activity under the Department of Defense, is a firm-fixed-price solicitation for the re-manufacture of sheet metal enclosures for the Data Transfer Device project, specifically targeting Side A and Side B of PCMCIA-based data cards. This effort is critical to sustaining supply lines for military platforms such as the F-22, C-130, and C-5, as the original Hirose-manufactured components have been discontinued. The contractor is required to design and fabricate stamping dies for both sides, produce at least three first articles per side, and deliver 60,000 production units for each side. Technical deliverables include 3D and 2D drawings, Special Tooling models, and Technical Review Minutes, all governed by government-provided standards and subject to unlimited data rights held by the U.S. Government. Deliverables must be submitted via email to the contracting officer by 1400 PST on July 31, 2026, with no online portal required. The place of performance is Linda, California, while the contracting office is located in McClellan, California. The solicitation is set aside exclusively for Service-Disabled Veteran-Owned Small Businesses, requiring offerors to self-certify small business status through SAM and comply with subcontracting limitations under FAR 52.219-14. Offerors must also affirm compliance with federal labor and ethical standards, including prohibitions on child labor, trafficking in persons, and employment discrimination against veterans. All contract clauses include deviation 2026-O0038, authorizing modifications to standard FAR provisions for commercial item acquisition. Quality of product and price are the sole evaluation factors, with award based on best value and trade-offs permitted between the two, not on a lowest price technically acceptable basis. Payment will be processed via Wide Area WorkFlow, and the contractor must retain stamping dies for at least one year post-delivery with prior coordination for disposition. Distribution of all technical data is restricted to DoD personnel and authorized contractors under Distribution Statement D, and no packaging, labeling, or bar-coding requirements are specified in the documentation.
General Info
Agency
NAICS
Place of Performance
0, CA, 95652, USASet-Aside
Timeline
Submission Closed
Organization & Contact Information
Full Description
See Attachments
More opportunities from Department Of Defense → Defense Microelectronics Activity
Same awarding agency
Find Active Opportunities Like This
Get AI-powered intelligence on the opportunities still open
Every page of the solicitation package shredded into a compliance breakdown
AI-powered matching based on your capabilities and past performance
Competitor and incumbent history on the requirement
Automated alerts on amendments, Q&A deadlines, and award
Join 650+ contractors already using CLEATUS
