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Precision PCB/Electronic Component Fabrication

Active
SBIR / STTR

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

General Info

Agency

Department of Defense → Defense Microelectronics ActivityView Agency

NAICS

334413 - Semiconductor and Related Device ManufacturingView NAICS

Place of Performance

Not specified

Set-Aside

SBA

Documents

This scope was carved out of DME26BZ05-NV001.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Additive Manufacturing for Flexible Electronics

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Timeline

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Organization & Contact Information

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AgencyDepartment of Defense → Defense Microelectronics Activity
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department of Defense → Defense Microelectronics Activity
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Office AddressN/A
ContactsNo contact information available

Full Description

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Supplies custom-fabricated printed circuit boards (PCBs) and specialized electronic components for prime contractors on Department of Defense (DoW/DoD) SBIR projects. Fabricates boards based on design specifications using high-precision PCB milling, additive electronics manufacturing, and specialized substrates. Requires ISO 9001 certification and FOCI disclosure compliance. Delivers physical prototype components and assembled circuit boards.

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Electronic Connector Manufacturing

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about 1 month ago

DEADLINE

in 13 days
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NAICS: 334418
SBIR / STTR
Additive Manufacturing for Flexible Electronics
Solicitation # DME26BZ05-NV001
The Defense Microelectronics Activity, under the Department of Defense, is soliciting Phase I feasibility studies for additive manufacturing of flexible electronics to support high-mix, low-volume manufacturing. The objective is to validate 3D printing methods for electronics packaging and assembly, specifically targeting the development of prototypes comparable to Radio Frequency multichip modules. Key technical goals include achieving printed trace widths of 5 mil or better, supporting 12x12 BGA with 0.5mm ball pitch, and ensuring thermal resilience up to 150 degrees Celsius. The effort seeks to reduce costs and manufacturing timelines by utilizing vat photopolymerization, aerosol jet printing, and integrated printed passives while establishing reliability data based on MIL-STD quality metrics. This solicitation, numbered DME26BZ05-NV001, is a total small business set-aside under NAICS code 334418, with a response deadline of September 23, 2026. Proposals must be submitted via the Defense SBIR/STTR Innovation Portal and are evaluated based on technical merit, investigator qualifications, and commercialization potential using a trade-off process. Awardees must comply with strict cybersecurity requirements, including CMMC Level 2 certification and NIST SP 800-172 standards. The contract is structured as a fixed-price research and development effort, requiring detailed technical and cost volumes, full disclosure of foreign affiliations, and adherence to specific small business work-performance percentages.
Printed Circuit Assembly (Electronic Assembly) Manufacturing

POSTED

about 1 month ago

DEADLINE

in 13 days
View Details

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