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CCA Manufacturing and Assembly Services

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract for CCA Manufacturing and Assembly Services involves the fabrication and assembly of high-quality Circuit Card Assemblies for prime contractors supporting NSWC PHD projects. The scope of work specifically covers the production of relay modules, MEB, HEB, and ethernet switch modules. Manufacturing processes include automated pick-and-place SMT assembly, stencil printing, reflow ovens, and through-hole assembly utilizing selective or wave soldering to deliver fully tested CCAs. The provider must maintain strict quality standards and hold certifications in ISO 9001, J-STD-001, IPC-6012, and IPC-A-610. This opportunity is managed by the Department of Defense under NAICS code 334418, with a response deadline set for October 24, 2026.

General Info

Subcontract for CCA manufacturing and assembly services for NSWC PHD projects by 10/24/2026.

Agency

Department Of Defense → Commanding OfficerView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

CA

Set-Aside

NONE

Documents

This scope was carved out of N6339426R0005.

The full solicitation package (10 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Vertical Launching System (VLS) Launch Sequencer (LSEQ) Multiple Award Contract (MAC) Indefinite Delivery Indefinite Quantity (IDIQ)

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Organization & Contact Information

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AgencyDepartment Of Defense → Commanding Officer
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Commanding Officer
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Fabricates and assembles high-quality Circuit Card Assemblies (CCAs) for prime contractors on NSWC PHD projects, specifically ethernet switch modules, MEB, HEB, and relay modules. Performs SMT assembly via automated pick-and-place, stencil printing, reflow ovens, and through-hole assembly using wave or selective soldering. Requires IPC-A-610, IPC-6012, J-STD-001, and ISO 9001 certifications. Delivers completed, tested CCAs.

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