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Center Construction and Build-out

Active
State & Local

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

General Info

Agency

New York → Empire State DevelopmentView Agency

NAICS

236220 - Commercial and Institutional Building ConstructionView NAICS

Place of Performance

NY, USA

Set-Aside

NONE

Documents

This scope was carved out of 2138328.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Downstate Semiconductor Chip Design Center

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Organization & Contact Information

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AgencyNew York → Empire State Development
ContactsNo contacts available
OfficeN/A
Organization / Agency
New York → Empire State Development
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Office AddressN/A
ContactsNo contact information available

Full Description

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Performs physical construction, renovation, or expansion for prime contractors on Empire State Development semiconductor chip design center projects. Executes new building construction, leasehold improvements, and general contracting management for high-tech facilities. Requires General Contractor license, bonding capacity, and adherence to NYS labor laws. Delivers a completed, habitable, and operational physical facility.

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More opportunities from New York → Empire State Development

Same awarding agency

NAICS: 541715
SLED
Downstate Semiconductor Chip Design Center
Solicitation # 2138328
Empire State Development is seeking a qualified 501(c)(3) nonprofit organization or consortium to lead the design, construction, development, and operation of a world-class Semiconductor Chip Design Center in downstate New York. The project, which may involve new construction or the modification of existing structures, will be located within the five boroughs of New York City or the counties of Putnam, Dutchess, Orange, Rockland, Westchester, Nassau, and Suffolk. The selected lead applicant will be responsible for establishing a sustainable operating model and providing shared access to industry-standard electronic design automation tools, computing resources, and secure design environments. Key objectives include supporting early-stage chip design research and prototyping, incubating semiconductor startups through intellectual property and commercialization guidance, and delivering workforce development programs to prepare New York residents for high-skill roles. The procurement is a multi-phase competitive process with an anticipated contract start date of July 2027. A grant of up to 25 million dollars is available for eligible capital costs, including construction, equipment, and environmental remediation. Award selection is based on the best value to the agency, evaluating factors such as the applicant's experience, work plan, and the quality of their justification for funds. The agency has established participation goals of 6 percent for Service-Disabled Veteran-Owned Businesses and 15 percent each for Minority and Women Business Enterprises. Awardees must adhere to strict insurance requirements, including professional and cyber liability coverage, and are required to submit annual performance reports for up to five years following project completion. Phase 1 concept papers are due by October 26, 2026.
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