This Combined Synopsis/Solicitation opportunity from Department Of Commerce was posted on February 24, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates

Awarded

1333ND26QNB030031Federal

Submission Closed03/09/2026, 03:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413

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Printed Circuit Board (PCB) FabricationThis subcontract opportunity is for the fabrication and supply of bare printed circuit boards to support prime contractors on DLA Weapons Support Maritime Supply Chain projects. The scope of work involves producing multi-layer PCBs in accordance with TDP Rev B Gen 2 specifications, which includes the application of silkscreens, solder masks, and the drilling and plating of vias using military-grade electrical and thermal materials. Performance will take place in Fort Bragg, North Carolina. This is a total small business set-aside under NAICS code 334413. Due to the nature of the defense materials, the selected provider must maintain US/Canada Joint Certification Program certification and ensure full compliance with ITAR and EAR regulations. Interested parties must submit their responses by November 9, 2026.

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POSTED

about 11 hours ago

DEADLINE

in 12 days

AI Contract Overview

The contract seeks proposals for the acquisition of a high-throughput, high-resolution X-ray laminography and tomography system tailored for advanced packaged semiconductor devices and substrates. This system is intended to enhance the Department of Commerce’s National Institute of Standards and Technology (NIST) capabilities in semiconductor device inspection and analysis. The solicitation, designated under number 1333ND26QNB030031, emphasizes cutting-edge technology to support the evolving needs of semiconductor metrology and research. The solicitation was posted on February 12, 2026, with a response deadline of February 26, 2026. It falls under the NAICS code 334413, which covers semiconductor manufacturing equipment. The contracting office is located in Gaithersburg, Maryland, and the primary point of contact for this opportunity is Tracy Retterer, with a secondary contact, Donald Collie, also available for inquiries. This combined synopsis solicitation includes detailed statements of work and applicable provisions and clauses to guide potential offerors in preparing their responses.

General Info

Seeking proposals for advanced X-ray laminography system for NIST semiconductor inspection.

Agency

Department Of Commerce Nist

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

Gaithersburg, MD, 20899, USA

Set-Aside

NONE

Documents

Attachment 2 - Applicable Provisions and Clauses

clauses-incorporated-by-reference

High

RFQ 1333ND26QNB030031 Combined Synopsis and Solicitation for X-ray Laminography System

rfq

High

Statement of Work for High-Throughput High-Resolution X-ray Laminography/Tomography System

sow

High

AI Contract Breakdown

Uniform Contract Format

Timeline

1 update

PhaseAwarded

PostedFeb 12

Combined Synopsis

Notice updatedFeb 24

Response deadline changed from Feb 26, 2026 to Mar 9, 2026. The notice description changed.

AwardedOct 29

Contract was awarded

Submission Closed

03/09/2026, 03:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Commerce Nist

Contacts2 people available

OfficeGAITHERSBURG, MD, 20899, USA

Organization / AgencyDepartment Of Commerce Nist

Office AddressGAITHERSBURG, MD, 20899, USA

Contacts

Tracy Retterer

contact@example.gov

Donald Collie

contact@example.gov

Full Description

Amendment 0001:

Amendment changes include the following:

The required response date is extended from February 26, 2026 to March 9, 2026
No Statement of work change
Questions and Answers:

Question1: Is there a cleanroom specification?

NIST Response: No. The instrument will be installed in a general purpose lab in the advanced measurement laboratory facility, but not within a cleanroom.

Question 2: Are you flexible on the footprint (size/dimension)

NIST Response: NIST expects the analytical instrument (source, stages, detectors, and shielded enclosure) to fit within the footprint specified by 10.2. Additional space is available in the lab around the instrument for service access, and for support equipment (including chase space for air compressor/dryer if required, and a work area in the lab for control and analysis PCs).

Question 3: Are the devices in JEDEC Trays?

NIST Response: Typically no. NIST requires significant flexibility to load samples that are within the size envelope described by specification 5. Samples will include full wafers, coupons (partial wafers), individual or groups of packaged devices, as well as atypical sample geometries. To meet requirement 5.1, vendors must include 5 sample carriers that are compatible with the automated loading system. Carriers supporting a JEDEC tray is only one possible way to meet that requirement.

See Combined Synopsis Solicitation_1333ND26QNB030031, Attachment 1 - Statement of Work, and Attachment 2 - Applicable Provisions and Clauses attachments for solicitation details.