Circuit Card Assembly (CCA) Manufacturing

This contract involves the full manufacturing process of defense-grade circuit card assemblies, encompassing component sourcing, PCB fabrication, surface mount technology (SMT), through-hole assembly, and comprehensive final testing. The work must adhere to strict defense procurement standards, ensuring the quality and reliability required for military applications. The contract is categorized under NAICS code 334418 and is issued as a subcontract by the Department of Defense through SPRMM1 DLA Mechanicsburg. Issued on April 8, 2026, the solicitation has a response deadline of June 8, 2026. While specific details about the place of performance and points of contact are not provided, the contract clearly targets highly specialized manufacturing services critical to defense supply chains. The emphasis on rigorous testing and compliance underscores the importance of meeting stringent military specifications throughout the production cycle.