This Government Contract opportunity from Department Of Defense was posted on April 29, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Circuit Card Assembly (CCA) Manufacturing

Closed

Federal

Submission Closed05/29/2026, 08:30:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

The contract entails full-scale manufacturing of printed circuit card assemblies to meet military specifications, covering all stages from component sourcing and procurement through assembly, rigorous testing, and complete documentation. The work must comply with demanding defense standards, ensuring reliability and traceability required for critical military applications. All activities are to be performed at the designated place of performance in Mechanicsburg, with oversight from the Department of Defense through the SPRMM1 DLA Mechanicsburg office. This is a subcontract opportunity with a NAICS code of 334412, indicating specialization in electronic component and board manufacturing. The solicitation was posted on April 29, 2026, and responses are due by May 29, 2026, at 8:30 PM, providing a one-month window for qualified subcontractors to submit proposals. There is no specified set-aside classification, and the contract is open to eligible participants seeking to support defense electronics manufacturing needs.

General Info

Full production of military-grade printed circuit card assemblies, including sourcing, assembly, testing, documentation.

Agency

Department Of Defense → SPRMM1 DLA Mechanicsburg

NAICS

334412 - Bare Printed Circuit Board ManufacturingView NAICS

Place of Performance

Mechanicsburg, PA, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRMM126QKE55.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SPRMM1-26-Q-KE55

AI Contract Breakdown

Uniform Contract Format

No contract breakdown available.

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Timeline

PhaseClosed

PostedApr 29

subcontract

Response DeadlineMay 29

Deadline has passed

Submission Closed

05/29/2026, 08:30:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → SPRMM1 DLA Mechanicsburg

Office AddressN/A

ContactsNo contact information available

Full Description

Full production of printed circuit card assemblies per military specifications, including component sourcing, assembly, testing, and documentation.

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