This Government Contract opportunity from Department Of Defense was posted on April 21, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Circuit Card Assembly (CCA) Manufacturing
Contract Overview
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AI Contract Overview
This contract involves the full manufacturing process of a Circuit Card Assembly (CCA), encompassing all stages from component sourcing and printed circuit board (PCB) fabrication to surface mount technology (SMT) assembly and final inspection. The manufacturing must adhere strictly to specific military standards, including MIL-STD-2073 for packaging and MIL-STD-129 for marking, ensuring compliance with defense-related quality and traceability requirements. Issued by the Department of Defense under the DLA Mechanicsburg office, this subcontract is classified under NAICS code 334412, which pertains to electronic component manufacturing. The solicitation was posted on April 21, 2026, with a response deadline of May 12, 2026. While detailed location and contact information are not specified, the contract emphasizes a comprehensive end-to-end production process for military-grade electronic assemblies.
General Info
Agency
NAICS
Place of Performance
PA, USASet-Aside
Documents
This scope was carved out of SPRMM126QME88.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
7HH 5998 013564673-CIRCUIT CARD ASSEMB
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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