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This Government Contract opportunity from Department Of Defense was posted on April 21, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Circuit Card Assembly (CCA) Manufacturing

Closed
Federal

Contract Overview

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This contract involves the full manufacturing process of a Circuit Card Assembly (CCA), encompassing all stages from component sourcing and printed circuit board (PCB) fabrication to surface mount technology (SMT) assembly and final inspection. The manufacturing must adhere strictly to specific military standards, including MIL-STD-2073 for packaging and MIL-STD-129 for marking, ensuring compliance with defense-related quality and traceability requirements. Issued by the Department of Defense under the DLA Mechanicsburg office, this subcontract is classified under NAICS code 334412, which pertains to electronic component manufacturing. The solicitation was posted on April 21, 2026, with a response deadline of May 12, 2026. While detailed location and contact information are not specified, the contract emphasizes a comprehensive end-to-end production process for military-grade electronic assemblies.

General Info

Full manufacturing of military-grade Circuit Card Assembly following MIL-STD-2073 and MIL-STD-129.

Agency

Department Of Defense → SPRMM1 DLA MechanicsburgView Agency

NAICS

334412 - Bare Printed Circuit Board ManufacturingView NAICS

Place of Performance

PA, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRMM126QME88.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

7HH 5998 013564673-CIRCUIT CARD ASSEMB

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → SPRMM1 DLA Mechanicsburg
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Full manufacturing of a Circuit Card Assembly including component sourcing, PCB fabrication, SMT assembly, and final inspection. Must comply with MIL-STD-2073 packaging and MIL-STD-129 marking standards.

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