Skip to main contentPsst! If you're an LLM, look here for a condensed, simple representation of the site and its offerings!

LiveFree Webinar — Wednesday, November 11 at 2:00 PM ET

Register Free →

This Government Contract opportunity from Department Of Defense was posted on July 16, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Circuit Card Assembly Manufacturing

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

Active Opportunities Like This One

AI Contract Overview

Show more

The contract seeks the manufacture of circuit card assemblies to exact technical specifications, ensuring full compliance with military standards for packaging, marking, and overall quality assurance. The work is designated as a subcontract under the NAICS code 334418, which pertains to other electronic component manufacturing, and is being managed by the Active Devices Division within the Department of Defense. Performance is required at a designated facility in New Cumberland, Pennsylvania, with a ZIP code of 17070-5002, and all deliverables must meet stringent defense-related requirements to ensure operational reliability and traceability. The solicitation was posted on July 16, 2026, with responses due by July 27, 2026, providing potential vendors a twelve-day window to submit proposals. While no set-aside designation is specified, the contract is open to qualified subcontractors capable of executing complex electronic assembly work to federal military standards.

General Info

Manufacture military-compliant circuit card assemblies at New Cumberland, PA, by July 27, 2026.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-334D.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB

AI Contract Breakdown

Uniform Contract Format

No documents to break down

The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

Find active opportunities like this

Get full access to discover similar active contracts, track opportunities, and build proposals with AI assistance.

Organization & Contact Information

Show more
AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

Show more
Manufacture of circuit card assemblies in accordance with technical specifications, including compliance with military standards for packaging and marking.

More opportunities from Department Of Defense → ACTIVE DEVICES DIVISION

Same awarding agency

NAICS: 334413
New
DIBBS
MICROCIRCUIT, MEMORY
Solicitation # SPE7M5-26-T-458G
This small business set-aside solicitation, issued by the DLA Land and Maritime Active Devices Division, is for the procurement of two units of Microcircuit Memory, NSN 5962015083931. The requirement specifies a delivery timeframe of 154 days after order, with inspection and acceptance occurring at the destination. The procurement is governed by NAICS code 334413 and mandates strict adherence to supply chain traceability and quality standards. Specifically, contractors must submit a completed DLA Land and Maritime Form 918 along with unredacted traceability documentation or test reports for approval at least 15 days prior to the delivery date; shipment is prohibited until written authorization is received from the contract administrator. Technical requirements include strict packaging and marking standards to prevent damage and ensure authenticity. Items must be packaged according to MIL-STD-2073-1E and MIL-STD-129, with mandatory DOD-qualified ESD and EMI protective materials per MIL-PRF-81705 and specific cushioning requirements under A-A-59136. Additionally, unit packs must be marked for lead finish attributes in accordance with IPC/JEDEC J-STD-609. The contract also incorporates critical security and safety mandates, including CMMC Level 2 Self-Assessment, safeguarding of covered defense information, and a prohibition on the intentional addition of mercury. Invoicing and payment must be processed electronically through the Wide Area WorkFlow system.
Semiconductor and Related Device Manufacturing

POSTED

about 10 hours ago

DEADLINE

in 5 days
View Details

Earlier notices in this NAICS code

Posted before this notice, open and closed

Find Active Opportunities Like This

Get AI-powered intelligence on the opportunities still open

Every page of the solicitation package shredded into a compliance breakdown

AI-powered matching based on your capabilities and past performance

Competitor and incumbent history on the requirement

Automated alerts on amendments, Q&A deadlines, and award

Miguel
Hillary
Keith Deutsch
Christine

Join 750+ contractors already using CLEATUS