Circuit Card Assembly Manufacturing and Testing

The contract entails the end-to-end manufacture, assembly, and testing of a defense-grade circuit card assembly identified by NSN 5998-01-519-3072, covering all aspects from sourcing certified components through printed circuit board assembly, precision soldering, rigorous quality control, and final performance verification under defense standards. All work must comply with stringent military specifications to ensure reliability and functionality in mission-critical environments, with full traceability of materials and processes required throughout production. The contract is classified as a subcontract under the NAICS code 334418 for other electronic component manufacturing, issued by the Defense Logistics Agency on behalf of the Department of Defense. Although specific performance location and point of contact details are not provided, the award is tied to the DIBBS system under contract SPE7M126P4311, and all activities must be completed in accordance with federal defense procurement guidelines. The solicitation was posted in July 2026, indicating a projected timeline for execution that aligns with upcoming defense system integration schedules.