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This Government Contract opportunity from Department Of Defense was posted on April 20, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Circuit Card Assembly Repair and Modification

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418
New
DIBBS
ELECTRONIC MODULE, STAN
Solicitation # SPE7M5-27-T-0997
Solicitation SPE7M5-27-T-0997, issued by the DLA Weapons Support Active Devices Division, is for the procurement of one standardized electronic module, identified by NSN 5963013531602 and Key Code CZJ. The requirement specifies a delivery timeline of 20 days with a required delivery date of October 13, 2026, shipped FOB Destination to the USS SEAWOLF SSN 21. The procurement is subject to strict quality and environmental standards, including a prohibition on Class I ozone-depleting substances and the intentional addition of mercury. Manufacturers must maintain an inspection system complying with SAE AS9003 or ISO 9001 tailored to SAE AS9003, and acceptance is based on zero non-conformances using sampling methods per MIL-STD-1916 or ASQ H1331. Critical technical requirements include mandatory DOD qualified Electrostatic Discharge and Electromagnetic Interference protective packaging per MIL-PRF-81705, with specific barrier materials from QPL-81705 manufacturers to prevent damage to leads and terminals. Marking must adhere to MIL-STD-129 with special marking code 39 for ESD sensitivity. Administratively, the contract requires CMMC Level 2 Self-Assessment, adherence to the Buy American Act and Berry Amendment, and the use of the Wide Area WorkFlow system for invoicing. Quotations are due by October 26, 2026, and must be submitted to the issuing office in Columbus, Ohio.
DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 17 hours ago

DEADLINE

in 2 days

AI Contract Overview

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This contract involves the teardown, evaluation, repair, and modification of military circuit card assemblies, which includes diagnostics, rework, and functional testing to meet original equipment manufacturer (OEM) specifications. The scope ensures that the repaired or modified assemblies maintain reliable performance in accordance with stringent military and manufacturer standards. The work is intended to extend the service life and functionality of these critical components used in defense systems. Issued by the Department of Defense through the Navsup Weapon Systems Support Mech office, this subcontract falls under the NAICS code 334418, which covers printed circuit assembly manufacturing. The solicitation was posted on April 20, 2026, with a response deadline of May 18, 2026. While specific location details for performance and contact information are not provided, the contract offers a clear opportunity for qualified subcontractors to support military hardware readiness by delivering high-quality circuit card assembly repair and modification services.

General Info

Teardown, repair, and testing of military circuit card assemblies to meet OEM and military standards.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

PA

Set-Aside

NONE

Documents

This scope was carved out of N0010426QQB38.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

N0010426QQB38

AI Contract Breakdown

Uniform Contract Format

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Teardown, evaluation, repair, and modification of military circuit card assemblies including diagnostics, rework, and functional testing to OEM specs.

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