CIRCUIT CARD ASSEMBLY

CIRCUIT CARD ASSEMBLY
CIRCUIT CARD ASSEMBLY
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
PYROGENESIS INC. L5954 P/N 1738-FPD
ROCKWELL AUTOMATION, INC. 01121 P/N 1738-FPD
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7018318962 0001 EA 1.000
NSN/MATERIAL:5998016634106
DELIVERY (IN DAYS):0005
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:GX CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:LT CUSH/DUNN THKNESS:B
UNIT CONT:E5 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:39 -39 ESD sensitiv electrnic dvce
SPE7M0-26-T-086D
SECTION B
PR: 7018318962 PRLI: 0001 CONT’D
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING
REQUIREMENTS FOR PROCUREMENT
ESD and PHYSICAL protection are required for contacts, leads, terminals, and other protrusions by means of container design, cushioning, and/or other ESD protective devices. Components with pins or leads shall have adequate cushioning to PREVENT DAMAGE, BREAKAGE and/or BENDING OF LEADS when not specified in the packaging codes.
This item requires DOD QUALIFIED Electrostatic Discharge (ESD) and/or Electromagnetic Interference (EMI) protective packaging materials in accordance with MIL-PRF-81705. All items subject to degradation from ESD/EMI environmental field forces shall be handled and packaged at an approved field force protective work station.
For ESD protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used along with MIL-PRF-81705, Type III (MIL-DTL-117 Type II, Class H, Style 2) barrier material wrap if the contract doesn't specifically require ESD approved cushioning.
For EMI protection MIL-PRF-81705, Type I (MIL-DTL-117, Type I, Class F, Style 1) converted bag barrier material shall be used.
The supplier shall be responsible for verifying that all MIL-PRF-81705 barrier materials (or converted bags) were supplied from a qualified manufacturer currently listed on QPL-81705.
For additional ESD/EMI packaging information, refer to the following DLA packaging website: https://www.dla.mil/HQ/LogisticsOperations/Packaging/PackFAQs/ESDS/
If the preservation method code in the solicitation does not specify ESD/EMI protection and the Offeror's proposed item of supply is subject to degradation from ESD/EMI environmental field forces, Offerors shall provide appropriate technical packaging data with their proposals.
ZZ ADDITIONAL SPECIAL MARKING: 39 ESD sensitive electronic device requirements of MIL-STD-129 apply
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
IP027: PACKING AND MARKING REQUIREMENTS FOR FEDERAL STOCK CLASS 5961
SEMICONDUCTORS AND HARDWARE DEVICES AND FSC 5962 ELECTRONIC
MICROCIRCUITS
PARCEL POST ADDRESS:
SPE7M0-26-T-086D
SECTION B
PR: 7018318962 PRLI: 0001 CONT’D
N62792
CVN/SSN MATERIAL SUPPORT
500 WEST PARK LANE
HAMPTON VA 23666-5027
US
RDD 999/NMCS SHIPMENT. SHIP BY FASTEST TRACEABLE MEANS. DO NOT USE PARCEL POST.
FREIGHT SHIPPING ADDRESS:
N62792
CVN/SSN MATERIAL SUPPORT
500 WEST PARK LANE
HAMPTON VA 23666-5027
US
M/F: (TCN) Q906136251H764
RDD: 999
PROJ: ON9 TP 1
SUPP ADD: N62792 SIG: J
FOR GOVERNMENT USE ONLY: (IPD) 03
DIC: A3A DIST: ADV: 2L FC: XP
Need Ship Date:00/00/0000 Original Required Delivery Date:09/15/2026
SPE7M0-26-T-086D NSN/Part Number: 5998-01-663-4106 Quantity: 1 EA Purchase Request: 7018318962QTY: 1 Delivery: 5 days ADO