This Government Contract opportunity from Department Of Defense was posted on May 6, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Commercial Shredder Supply and Delivery

Closed

Federal

Submission Closed05/15/2026, 07:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 333242

New

Canada

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ACAN 26-58022 Automated Wafer Defect Inspection System and ICP Plasma Processing ModuleThe National Research Council Canada, through the Canadian Photonics Fabrication Centre, intends to procure an Automated Wafer Defect Inspection System (Surface Defect Inspection Platform - SDIP) and an Inductively Coupled Plasma (ICP) Processing Module to support advanced semiconductor photonic device fabrication. The SDIP system must provide non-destructive, laser-based, high-resolution optical surface inspection capable of detecting and characterizing sub-micron defects on various compound semiconductor substrates including GaAs, InP, GaN, sapphire, Si, Ge, and GaN on SiC. It will incorporate automated cassette-to-cassette wafer handling, generate detailed defect maps, and support integration with existing inspection workflows and data sets. The ICP processing module must integrate seamlessly with the existing KLA/SPTS Omega fxP plasma processing platform, supporting high-density plasma etching for 4-inch wafers of compound semiconductor materials, maintaining compatibility with current hardware, software, and process controls. Due to the proprietary nature of the existing Omega fxP system, KLA Corporation is the sole supplier capable of meeting the technical requirements and ensuring operational interoperability and system coherence. The procurement is subject to multiple trade agreements with invoked exceptions for limited tendering based on a lack of competition for technical reasons and intellectual property considerations. Delivery deadlines are set for March 31, 2027, for the SDIP system and June 30, 2027, for the ICP module. While a pre-identified supplier has been named, other suppliers may submit statements of capabilities by June 29, 2026, to demonstrate their qualifications for the contract. All supplied electrical equipment must comply with Canadian Electrical Code certification standards.

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TPT Manual Wire BonderThe National Institute of Standards and Technology (NIST) is conducting a sources sought notice to gather information from potential suppliers capable of providing a TPT manual wire bonder that meets specific technical criteria. The wire bonder must support multiple bonding modes, including wedge, ball, and ribbon wire bonding, with quick reconfiguration within five minutes. It should allow fully manual control over the X, Y, and Z axes during operation and accommodate gold and aluminum wire diameters ranging from 17 to 75 micrometers, as well as ribbon wire widths from 20 to 250 micrometers. Key system features include an ultrasonic transducer operating between 60 and 70 kHz with PLL control, power output up to 10 watts, adjustable bond time and force ranges, a 90-degree wire feed angle, motorized wire clamp, adequate throat depth and table motion, and a temperature controller with high precision and a limit of at least 250°C. The equipment must be compact, fitting within a tabletop footprint smaller than 600 x 600 x 300 mm. The interface requirements specify an integrated operator display supporting storage of a minimum of 20 bonding programs and allowing easy parameter adjustments. Respondents are asked to submit company details, capabilities relative to the requirements, reseller authorization status, any perceived restrictive aspects of the specifications, and their small business status through email by the stated deadline. The notice clarifies that this is not a solicitation or request for quotations, no contract will be awarded directly from this notice, and respondents bear no costs. NIST intends to use the information received for future procurement planning and may engage further with interested firms to refine its requirement understanding. All questions must be submitted by a specified date to be addressed through an amendment.

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Low Profile IR Preheater SupplyThe contract involves the procurement of four low-profile infrared preheaters designed for electronics rework applications. Each unit will have a power output of 1.6 kW and be capable of reaching a maximum temperature of 200°C, with specifications similar to the PACE PH100E model. These preheaters are intended to support precise heating needs in sensitive electronic component repair and assembly processes. Issued by the Department of Defense through its W6QK Acc-Apg Cont Ct Tyad Office, the contract is classified under NAICS code 333242, which pertains to semiconductor and related device manufacturing. The equipment is to be delivered to a performance location in Tobyhanna and the solicitation was posted on June 12, 2026, with a response deadline of June 25, 2026. This opportunity is a subcontract arrangement, facilitating the supply of specialized infrared heating devices to support defense-related electronics maintenance and production operations.

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POSTED

5 days ago

DEADLINE

in 9 days

AI Contract Overview

The contract entails the procurement and delivery of commercial-grade paper shredders that meet Department of Defense specifications. These shredders must be properly packaged and labeled, with all shipment logistics managed to ensure delivery to Okinawa, Japan. The solicitation was posted on May 6, 2026, with a response deadline of May 15, 2026, and is categorized as a subcontract under the NAICS code 333242, which relates to manufacturing machinery and equipment. The contracting agency overseeing this effort is the Department of Defense, specifically through the office of the Commanding Officer. This opportunity does not specify any set-aside requirements or particular organization types for bidders. Although complete address details for the performing office are not provided, the place of performance is clearly stated as Okinawa. Interested parties are expected to comply with all relevant DoD standards for the shredders, including strict adherence to packaging and shipping protocols to meet the operational needs of the military installation in Okinawa.

General Info

Procurement and delivery of DoD-spec commercial paper shredders to Okinawa, Japan by May 15, 2026.

Agency

Department Of Defense → Commanding Officer

NAICS

333242 - Semiconductor Machinery Manufacturing View NAICS

Place of Performance

Okinawa, JP-47, JPN

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PhaseClosed

PostedMay 6

subcontract

Response DeadlineMay 15

Deadline has passed

Submission Closed

05/15/2026, 07:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Commanding Officer

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Commanding Officer

Office AddressN/A

ContactsNo contact information available

Full Description

Procurement and delivery of commercial-grade paper shredders compliant with DoD requirements, including packaging, labeling, and shipment logistics to Okinawa, Japan.