This Government Contract opportunity from Department Of Defense was posted on April 16, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Compound Semiconductor Design and Foundry Integration

Closed

Federal

Submission Closed07/31/2026, 11:59:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418

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Solicitation # W911S226U4471

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Solicitation # N0038326QMB45

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Solicitation # N0038326QPD13

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Nashville Electric Service

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in 6 days

AI Contract Overview

This contract involves providing specialized design and integration support for compound semiconductors, specifically gallium nitride (GaN) and indium phosphide (InP), across multiple semiconductor foundries. The goal is to ensure both manufacturability and performance within three-dimensional heterogeneous integration (3DHI) architectures. The work focuses on leveraging expertise in semiconductor design to optimize these materials for advanced manufacturing processes, facilitating their use in cutting-edge technologies. Issued by the Defense Advanced Research Projects Agency under the Department of Defense, this subcontract falls under the NAICS code 334418, which pertains to semiconductor manufacturing. The contract was posted on April 16, 2026, with responses due by July 31, 2026. It does not specify set-aside designations or detailed location information for performance or points of contact. The emphasis is on collaborative involvement with various foundries to support development and integration efforts for compound semiconductor applications.

General Info

Provide GaN and InP design support for 3D semiconductor integration across multiple foundries.

Agency

Department Of Defense → Defense Advanced Research Projects AgcyView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Set-Aside

NONE

Documents

This scope was carved out of DARPA-SN-26-69.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

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AI Contract Breakdown

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No contract breakdown available.

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Timeline

PhaseClosed

PostedApr 16

subcontract

Response DeadlineJul 31

Deadline has passed

Submission Closed

07/31/2026, 11:59:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Defense Advanced Research Projects Agcy

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

Provide design and integration support for compound semiconductors (GaN, InP) across multiple foundries to ensure manufacturability and performance in 3DHI architectures.