Perrseus

The Perrseus program, issued by the DARPA Multi X Office under solicitation DARPA-PS-26-127, seeks innovative proposals to develop microscale ultra-high-vacuum systems (µUHV) capable of maintaining pressures below 10^-10 mbar. The primary objective is to create manufacturable, low size, weight, and power (SWaP) packages that integrate cold-atom quantum sensors, MEMS, and photonic sensors. The program focuses on advancing housing materials, bonding processes, and measurement techniques to enable high-volume manufacturing of these advanced devices. Awards will be made via Other Transaction for Prototype Agreements under 10 U.S.C. 4022, with a performance period consisting of a 24-month base phase and an 18-month option phase. Proposals are evaluated based on overall scientific and technical merit, relevance to the DARPA mission, and budget, price, and schedule, listed in descending order of importance. Eligible prime performers must be commercial or private sector entities, as FFRDCs, UARCs, and government entities are restricted to subcontractor roles providing unique capabilities. Submissions must be uploaded via the Broad Agency Announcement Tool by September 23, 2026. Strict security requirements are in place, including mandatory CMMC Level 2 (Self-Assessment) compliance posted in the Supplier Performance Risk System, adherence to NIST 800-171 and DFARS 252.204-7012 for Controlled Unclassified Information, and the submission of DARPA eForm 60 for all participating foreign nationals and U.S. permanent residents.