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Controller for PIF Bruker Icon

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Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This project, managed by the Department of Commerce's Office of the Director, focuses on establishing a measurement infrastructure to ensure the reliability and provenance of devices utilizing advanced 2D and wide-band gap materials. By creating a robust measurement framework, the initiative aims to mitigate common pitfalls in electronics development, specifically for systems critical to national security and defense applications. The specific procurement forecast is for a Controller for PIF Bruker Icon, with the work to be performed in Boulder, Colorado. Classified under NAICS code 334413, the project seeks to enable high confidence in the manufacturing of next-generation electronics by integrating reliability testing early in the development process.

General Info

Commerce Department procurement for a PIF Bruker Icon Controller in Boulder, Colorado.

Agency

Department Of Commerce → Office of the Director

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

BOULDER, CO

Set-Aside

NONE

Documents

0

No documents available

Documents will appear here when they are available.

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Timeline

PostedNov 30

forecast

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Organization & Contact Information

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AgencyDepartment Of Commerce → Office of the Director

Contacts1 person available

OfficeN/A

Organization / AgencyDepartment Of Commerce → Office of the Director

Office AddressN/A

Contacts

NATHALI MEDINA

contact@example.gov

Full Description

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The purpose of this project is to provide the necessary measurement infrastructure to enable high confidence in manufacturing reliable devices containing advanced materials (herein 2D and wide-band gap materials). Reliability and provenance are often not considered early in electronics development, but they are essential steps of advanced electronic systems necessary for national security and defense applications. This project addresses a significant pitfall in electronics for national security that are based on wide-band gap materials and builds out measurement framework for early adoption of next-generation electronics containing 2D materials as functional components.

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