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3D DIC System One pair of cameras, Lighting, Software

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The Department of Commerce, through the Office of the Director, is forecasting the acquisition of a High-Performance 3D DIC System, including a pair of cameras, lighting, and software. This system will feature integrated environmental chambers designed to perform non-contact optical measurements of semiconductor packages. The equipment will be utilized in Gaithersburg, Maryland, under NAICS code 334413 to support the CHIPS R&D Metrology Program. This investment specifically supports Grand Challenge 3 by enabling the characterization of advanced packaging integration and the creation of open-source reliability tools. By providing critical warpage and strain data for polymeric advanced packaging components such as redistribution layers and thermal interface materials, the system aims to enhance reliability design efficiency and reduce development costs for United States manufacturers.

General Info

Commerce seeks a 3D DIC System for semiconductor packaging measurements in Gaithersburg, Maryland.

Agency

Department Of Commerce → Office of the Director

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

GAITHERSBURG, MD

Set-Aside

NONE

Documents

0

No documents available

Documents will appear here when they are available.

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Organization & Contact Information

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AgencyDepartment Of Commerce → Office of the Director
Contacts1 person available
OfficeN/A
Organization / AgencyDepartment Of Commerce → Office of the Director
Office AddressN/A
Contacts
NATHALI CLARK
contact@example.gov

Full Description

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The Infrastructure and Materials Group requires the acquisition of a High-Performance 3D DIC System with integrated environmental chambers to perform non-contact optical measurements of semiconductor packages. This acquisition is directly aligned with the CHIPS R&D Metrology Program’s mission to advance measurement science for the semiconductor ecosystem, specifically supporting Grand Challenge 3 by enabling the characterization of advanced packaging integration and providing new open-source reliability tools. By providing the semiconductor industry with accurate warpage and strain data for sensitive, highly critical components like polymeric advanced packaging (e.g. underfills, redistribution layers, and thermal interface materials), this investment will significantly improve reliability design efficiency and reduce development time and costs for US manufacturers.This equipment is critical to achieving the project's mission of deve

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