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Mobile, Integrable, Closed Cycle Cryostat (MIC3)

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Federal

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The Department of Commerce, through the Office of the Director and NIST, is forecasting the procurement of a Mobile, Integrable, Closed Cycle Cryostat (MIC3). This acquisition supports the CHIPS Act and specifically addresses Grand Challenge 1, which aims to strengthen the U.S. semiconductor industry by improving metrology tools and measurement science. The primary objective is to enhance the assessment of the purity, properties, and provenance of materials, with a specific focus on evaluating the reliability and optical spectroscopy responses of two-dimensional and wide band gap materials and devices. The project will be performed in Gaithersburg, Maryland, under NAICS code 334413. This initiative is critical for understanding the robustness of advanced materials to ensure their successful application within the semiconductor sector. Interested parties can find further information through the Department of Commerce procurement forecasts.

General Info

NIST seeks a Mobile Integrable Closed Cycle Cryostat to enhance semiconductor material metrology.

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

GAITHERSBURG, MD

Set-Aside

NONE

Documents

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Commerce → Office of the Director
Contacts1 person available
OfficeN/A
Office AddressN/A
Contacts
NATHALI CLARK

Full Description

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As part of the CHIPS Act, researchers from NIST are actively pursuing a comprehensive program in metrology research and development aimed at bolstering the U.S. semiconductor industry. A pivotal aspect of their strategic objectives is outlined in one of the seven Grand Challenges—specifically, Grand Challenge 1. This challenge focuses on enhancing metrology tools and measurement science dedicated to assessing the Purity, Properties, and Provenance of materials, which are critical for advancing the semiconductor sector.A targeted initiative under this challenge involves the evaluation of the reliability of both two-dimensional (2D) and wide band gap (WBG) materials and devices. This evaluation is crucial for understanding the robustness and potential applications of these advanced materials in the semiconductor industry. To effectively conduct this research, and particularly to analyze the optical spectroscopy responses of materials

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