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Custom Diffractometry and Fourier Ptychography Endstation

Active

Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The Department of Commerce, through the Office of the Director, is seeking to acquire a Custom Diffractometry and Fourier Ptychography Endstation to be located in Gaithersburg, Maryland. This specialized experimental apparatus is designed to utilize short wavelength EUV light within a vacuum to perform non-destructive three-dimensional measurements of transistors and other minute features on computer chips. The system will enable the accurate quantitative reconstruction of dimensional structures from reflective diffraction, directly supporting the CHIPS R&D Metrology Program's Grand Challenge 2 and project 2.07 regarding EUV Scatterometry. This procurement is categorized under NAICS code 334413 and is currently listed as a forecast posted on April 16, 2026. The project aims to advance critical metrology capabilities essential for the future of microelectronics manufacturing. Interested parties may coordinate through the designated point of contact, Nathali Clark, as the agency works to enhance its capacity for high-precision semiconductor analysis.

General Info

Commerce seeks a custom EUV diffractometry endstation for semiconductor metrology in Gaithersburg, Maryland.

Agency

Department Of Commerce → Office of the Director

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

GAITHERSBURG, MD

Set-Aside

NONE

Documents

0

No documents available

Documents will appear here when they are available.

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Timeline

PostedApr 16

forecast

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Organization & Contact Information

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AgencyDepartment Of Commerce → Office of the Director

Contacts1 person available

OfficeN/A

Organization / AgencyDepartment Of Commerce → Office of the Director

Office AddressN/A

Contacts

NATHALI CLARK

contact@example.gov

Full Description

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The NDCD needs to acquire a customized diffractometry end station, which will be a new experimental apparatus that will harness short wavelength EUV light for the non-destructive three-dimensional measurement of the smallest features of computer chips, their transistors. This procurement supports the CHIPS R&D Metrology Program's Grand Challenge 2 to advance metrology for future microelectronics manufacturing and project 2.07, “EUV Scatterometry.” The application of the required end station is the accurate quantitative reconstruction of dimensional structure of periodic and other patterned features from the reflective diffraction off a sample under test using EUV light, which will only propagate in a vacuum.

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