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XPS System (X-Ray Photoelectron Spectroscopy System)

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Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The Department of Commerce, through the Office of the Director, is forecasting the acquisition of an advanced X-Ray Photoelectron Spectroscopy system to support the CHIPS Metrology Program in Gaithersburg, Maryland. This high-specification tool will feature Hard X-ray Photoelectron Spectroscopy for deep surface analysis exceeding 20 nanometers, small area imaging, and Gas Cluster Ion Beam technology for gentle surface cleaning. The system is designed to analyze chemical compositions, probe material properties during packaging, and study electronic structures through in-situ surface modification capabilities. Classified under NAICS code 334413, this procurement aims to significantly upgrade the agency's ability to analyze interfaces up to 30 nanometers. The project is intended to enhance overall surface analysis capabilities for both current and future research initiatives. Interested parties may coordinate through the designated point of contact, Nathali Medina, as the agency seeks to integrate these advanced diagnostic capabilities into its metrology infrastructure.

General Info

Commerce seeks an advanced X-Ray Photoelectron Spectroscopy system for the CHIPS Metrology Program.

Agency

Department Of Commerce → Office of the Director

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

GAITHERSBURG, MD

Set-Aside

NONE

Documents

0

No documents available

Documents will appear here when they are available.

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Timeline

PostedMay 5

forecast

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Organization & Contact Information

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AgencyDepartment Of Commerce → Office of the Director

Contacts1 person available

OfficeN/A

Organization / AgencyDepartment Of Commerce → Office of the Director

Office AddressN/A

Contacts

NATHALI MEDINA

contact@example.gov

Full Description

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NIST is acquiring an advanced XPS system with HAXPES and small area imaging to boost its CHIPS Metrology Program. This tool will analyze surface and chemical composition (including interfaces up to 30 nm), probe material properties during packaging, and study electronic structure. Key features include HAXPES for deeper analysis (over 20 nm), GCIB for gentle cleaning, and in-situ capabilities for surface modification and electronic structure study. This upgrade will significantly enhance NIST's surface analysis capabilities for current and future projects.

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