CHIPS R&D: 2D Transfer System

The Department of Commerce, through the Office of the Director, is forecasting the procurement of two automatic 2D transfer systems under the CHIPS R&D initiative. These systems are designed to enable the precise and efficient transfer of 2D materials onto various substrates, which is essential for fabricating complex layered test devices used in the study of next-generation electronics. This acquisition specifically supports NIST CRADA work with Intel by allowing for the development of electronic test structures to evaluate reliability. To maximize throughput and prevent the damage of fragile materials during transit, one system will be installed in Gaithersburg, Maryland, and the other in Boulder. The procurement falls under NAICS code 334413 and is managed by the Department of Commerce to ensure the production of state-of-the-art devices required for critical research testing.