Custom Wafer Services

The Department of Commerce Office of the Director is forecasting a requirement for Custom Wafer Services to be performed in Gaithersburg, Maryland. This initiative focuses on addressing the metrology challenges associated with measuring mechanical strain in nanoscale semiconductor devices, which is critical for ensuring high yield and optimal product performance. The project aims to advance various measurement techniques, including EBSD, TKD, 4-D STEM, Raman, and µXRD, to improve accuracy as geometric complexity in devices increases. By refining these methods and supplying new reference materials, the agency intends to secure the necessary capabilities for the development of future-generation semiconductor devices.