Design, Development, Manufacturing, and Testing of the Thermal Loop Pumps for the Advanced Portable Life Support System (PLSS)

NASA/Johnson Space Center (JSC) plans to issue a Request for Proposal (RFP) for Design, Development, Manufacturing, and Testing of the Thermal Loop Pumps for the Advanced Portable Life Support System (PLSS) in support of NASA's next generation space suit, the Exploration Extravehicular Mobility Unit (EMU) (xEMU). The PLSS being developed for the xEMU will offer many significant advantages over the current EMU PLSS which includes two thermal control loops (TCLs) inside the PLSS, one primary and one auxiliary. Deliverables for this effort will include a Preliminary Design Review, Pre-Manufacturing Review, Full Drawings set, Electrical De-rating Analysis and Radiation Assessment, as well as Stress and Thermal Analysis. The Government does not intend to acquire a commercial item using FAR Part 12. The NAICS Code and Size Standard are 541715 Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology) and 1,250, respectively. All responsible sources may submit an offer which shall be considered by the agency. The anticipated release date of the RFP is on or about July 30, 2018 with an anticipated offer due date of on or about August 29, 2018. NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html . The solicitation and any documents related to this procurement will be available over the Internet. These documents will reside on a World Wide Web (WWW) server, which may be accessed using a WWW browser application. Prospective offerors shall notify this office of their intent to submit an offer. It is the offeror's responsibility to monitor the Internet site for the release of the solicitation and amendments (if any). Potential offerors will be responsible for downloading their own copy of the solicitation and amendments (if any). All contractual technical questions must be submitted in writing (e-mail). Telephone questions will not be accepted.