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Electrical Heat Sink Manufacturing

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract involves the fabrication of a military-spec electrical heat sink with part number 623-1742-001 and NSN 5999-01-060-1302, requiring full compliance with defense electronics standards. The work encompasses precision machining, strict material sourcing and verification, and comprehensive thermal validation to ensure performance under operational constraints. All processes must adhere to国防部 specifications for reliability and durability in high-stress environments typical of military applications. This is a subcontract opportunity under NAICS code 334413, issued by the Department of Defense through the MARITIME SUPPLY CHAIN ESOC BUYS office, with performance required at Robins AFB, Georgia, zip code 31098-1626. The solicitation was posted on August 2, 2026, and responses are due by August 13, 2026. No set-aside provisions are specified, and the procurement is open to qualified subcontractors capable of delivering certified, military-grade components meeting all technical and compliance requirements outlined in the associated documentation.

General Info

Fabricate military heat sink per defense specs, deliver to Robins AFB by August 13, 2026.

Agency

Department Of Defense → MARITIME SUPPLY CHAIN ESOC BUYSView Agency

NAICS

334413 - Semiconductor and Related Device ManufacturingView NAICS

Place of Performance

ROBINS AFB, GA, 31098-1626, US

Set-Aside

NONE

Documents

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No documents available

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → MARITIME SUPPLY CHAIN ESOC BUYS
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → MARITIME SUPPLY CHAIN ESOC BUYS
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Office AddressN/A
ContactsNo contact information available

Full Description

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Fabrication of a military-spec electrical heat sink (P/N 623-1742-001, NSN 5999-01-060-1302) including machining, material compliance, thermal validation, and adherence to defense electronics standards.

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