This Government Contract opportunity from Department Of Defense was posted on July 27, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Electronic Component Manufacturing – Digital Microcircuit Production
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
The contract requires the manufacture of a digital microcircuit identified by NSN 5962-01-125-7375, produced in full compliance with military specifications. Critical requirements include strict material traceability across all components and adherence to source-controlled drawings, ensuring that every aspect of the design and fabrication aligns precisely with authorized technical documentation. Additionally, the product must feature J-STD-609-compliant lead finish marking to guarantee proper identification and reliability under demanding operational conditions. The work is to be performed at a designated location in Columbus with a zip code of 43213, and the manufacturing process must meet the highest standards of quality and documentation expected by the Department of Defense. This is a subcontract solicitation issued by the Active Devices Division under the NAICS code 334413 for electronic component manufacturing. The solicitation was posted on July 27, 2026, with responses due by August 7, 2026, leaving a narrow window for qualified contractors to submit proposals. The contract does not specify any set-aside status and is not tied to a particular small business category. All submissions must be made through the DIBBS system using the provided reference number SPE7M526T355Q, and bidders are expected to demonstrate proven capability in defense-grade microcircuit production, with robust quality control and documentation systems in place to support traceability and compliance throughout the supply chain.
General Info
Agency
NAICS
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-355Q.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, DIGITAL
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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