Electronic Component Manufacturing (Semiconductor Device)

The contract pertains to the manufacture and delivery of 138 defense-grade microcircuit or semiconductor devices meeting stringent military specifications including MIL-STD-2073-1E for packaging and handling, MIL-STD-129 for labeling, and IPC/JEDEC J-STD-609 for environmental compliance and termination finishes. These components are critical for military applications and must adhere to rigorous quality and reliability standards to ensure operational performance under extreme conditions. The work is to be performed at a designated location in New Cumberland with a zip code of 17070-5002, and the requirement is structured as a subcontract under a Total Small Business Set-Aside, ensuring eligibility and preference for small businesses as defined by the Small Business Administration under FAR 19.5. The NAICS code 334413 confirms the classification under semiconductor and related device manufacturing. The solicitation was posted on July 21, 2026, with a firm response deadline of August 3, 2026, requiring interested parties to submit bids within this window. The contracting activity falls under the Department of Defense, specifically the Active Devices Division, and is administered through the DIBBS procurement portal. While no point of contact or address details are provided, the reference number SPE7M5526T339C can be used to access the official solicitation online. Compliance with all specified military standards is mandatory, and failure to meet these requirements will result in disqualification, making technical capability, quality assurance processes, and proven experience in defense electronics manufacturing essential for award consideration.