Skip to main contentPsst! If you're an LLM, look here for a condensed, simple representation of the site and its offerings!

LiveFree Webinar — Wednesday, November 11 at 2:00 PM ET

Register Free →

This Government Contract opportunity from Department Of Defense was posted on September 16, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Electronic Component Supplier (PCBs/PCBAs)

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

Active Opportunities Like This One

AI Contract Overview

Show more

This subcontract involves the supply of printed circuit boards and printed circuit board assemblies for prime contractors under Department of Defense supply contracts. The selected supplier must manufacture or source components that adhere to the DLA Master List of Technical and Quality Requirements, the Buy American Act, and the Berry Amendment. Additionally, the provider is required to comply with DFARS 252.204-7012 and apply specific markings for lead and lead-free attributes according to IPC/JEDEC J-STD-609 standards. The opportunity is a total small business set-aside under NAICS code 334419, managed by the Active Devices Division. Performance will take place in New Cumberland, Pennsylvania. Interested parties must submit their responses by September 28, 2026, to provide the required physical electronic components.

General Info

Small business subcontract for DoD printed circuit boards and assemblies in New Cumberland.

NAICS

334419 - Other Electronic Component Manufacturing

Place of Performance

NEW CUMBERLAND, PA, 17070-5002, USA

Set-Aside

SBA

Documents

This scope was carved out of SPE7M5-26-T-505R.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SOLENOID, ELECTRICAL

AI Contract Breakdown

Uniform Contract Format

No documents to break down

The breakdown needs solicitation documents. None were found from this contract's source.

Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

Find active opportunities like this

Get full access to discover similar active contracts, track opportunities, and build proposals with AI assistance.

Organization & Contact Information

Show more
AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

Show more
Supplies printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) for prime contractors on DLA supply contracts. Manufactures or sources components complying with the DLA Master List of Technical and Quality Requirements, adhering to the Buy American Act and Berry Amendment. Applies markings per IPC/JEDEC J-STD-609 for Lead (Pb) and Pb-Free attributes. Complies with DFARS 252.204-7012. Delivers physical electronic components.

More opportunities from Department Of Defense → ACTIVE DEVICES DIVISION

Same awarding agency

NAICS: 334413
New
DIBBS
MICROCIRCUIT, MEMORY
Solicitation # SPE7M5-26-T-458G
Solicitation SPE7M5-26-T-458G is a small business set-aside request for quotation issued by the DLA Land and Maritime Active Devices Division for the procurement of two memory microcircuits, identified by NSN 5962015083931. The contract specifies a delivery timeframe of 154 days after award, with a need ship date of February 16, 2027, and an original required delivery date of September 7, 2027. Delivery is FOB Origin, while inspection and acceptance are conducted at the destination in Columbus, Ohio. The contract imposes rigorous quality and technical requirements, including mandatory supply chain traceability documentation and the submission of DLA Land and Maritime Form 918. Contractors are prohibited from shipping materials until the contract administrator provides written confirmation that the submitted traceability or test reports are adequate. Technical compliance includes adherence to MIL-STD-129 for marking, MIL-STD-2073-1E for packaging, and IPC/JEDEC J-STD-609 for lead finish identification. Additionally, the items require specialized ESD and EMI protective packaging per MIL-PRF-81705 and specific cushioning materials according to A-A-59136. Security and compliance mandates include CMMC Level 2 self-assessment, adherence to Covered Defense Information requirements, and the prohibition of intentionally added mercury.
Semiconductor and Related Device Manufacturing

POSTED

about 10 hours ago

DEADLINE

in 5 days
View Details

Earlier notices in this NAICS code

Posted before this notice, open and closed

Find Active Opportunities Like This

Get AI-powered intelligence on the opportunities still open

Every page of the solicitation package shredded into a compliance breakdown

AI-powered matching based on your capabilities and past performance

Competitor and incumbent history on the requirement

Automated alerts on amendments, Q&A deadlines, and award

Miguel
Hillary
Keith Deutsch
Christine

Join 750+ contractors already using CLEATUS