This Government Contract opportunity from Department Of Homeland Security was posted on April 30, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Electronic Components Repair (Level 1)
Contract Overview
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The contract pertains to the repair of electronic components integrated into composite assemblies, specifically targeting connectors, sensors, and embedded systems housed within composite panels. These repairs are classified as Level 1, indicating foundational maintenance tasks requiring technical expertise in electronics and composite materials without full system overhaul. The work is being solicited as a subcontract under NAICS code 334290, which aligns with other electronic component manufacturing and repair services. The opportunity is managed by the Aviation Logistics Center under the Department of Homeland Security, with responses due by May 29, 2026, at 4:00 PM. Although specific performance locations and points of contact are not provided, the nature of the work implies the need for specialized facilities capable of handling delicate electronic assemblies within composite structures. Participation is open without set-aside restrictions, and interested parties must submit proposals prior to the deadline to be considered for award.
General Info
Agency
NAICS
Place of Performance
NCSet-Aside
Documents
This scope was carved out of 70Z03826RL0000006.
The full solicitation package (5 documents), including the RFP, is on the prime solicitation, not on this scope.
Repair of HC-144 Composite Panels
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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