Epitaxial Silicon (Si) Wafer Fabrication – Spec 1

The contract involves the fabrication of thin silicon epitaxial layers on silicon substrates with stringent requirements for thickness uniformity, precise doping concentration, and defect-free crystal structure to meet advanced semiconductor standards. The work is classified under NAICS code 334413 and is solicited as a Total Small Business Set-Aside under SBA guidelines, ensuring eligibility and preference for small businesses. The project is sponsored by the Department of Commerce through NIST, indicating a focus on high-precision materials development for national scientific or technological advancement, though no specific performance location or point of contact is provided in the data. Responses are due by May 12, 2026, at 5:00 PM, with the solicitation posted on April 27, 2026, allowing approximately two weeks for proposal preparation. The contract type is identified as a subcontract, suggesting it may be part of a larger project or program managed by NIST, potentially supporting research, development, or calibration initiatives requiring ultra-pure, structurally controlled silicon materials. The absence of detailed contact or location information implies the solicitation is primarily administrative and may require potential offerors to actively seek further technical specifications through official channels linked via the provided SAM.gov URL.