Epoxy Adhesive Bonding and Assembly
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract, titled Epoxy Adhesive Bonding and Assembly, involves the structural bonding of sub-components for prime contractors working on Department of the Army door subassembly projects. The work requires the application of epoxy adhesive bonding using precision curing equipment and ovens, with strict adherence to MIS-21030 standards and specifications to deliver completed bonded door subassembly components. The opportunity is issued by the Department of Defense through the W6QK Lad Contr Office and is designated as a Total Small Business Set Aside under NAICS code 332999. Performance will take place in Chambersburg, with a response deadline of September 11, 2026.
General Info
Agency
NAICS
Place of Performance
Chambersburg, PA, USASet-Aside
Documents
This scope was carved out of W911N226QA063.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
Fabrication of Door Subassemblies
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Timeline
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Organization & Contact Information
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