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Epoxy Adhesive Bonding and Assembly

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract, titled Epoxy Adhesive Bonding and Assembly, involves the structural bonding of sub-components for prime contractors working on Department of the Army door subassembly projects. The work requires the application of epoxy adhesive bonding using precision curing equipment and ovens, with strict adherence to MIS-21030 standards and specifications to deliver completed bonded door subassembly components. The opportunity is issued by the Department of Defense through the W6QK Lad Contr Office and is designated as a Total Small Business Set Aside under NAICS code 332999. Performance will take place in Chambersburg, with a response deadline of September 11, 2026.

General Info

Small business subcontract for Army door subassembly epoxy bonding in Chambersburg by 2026.

Agency

Department Of Defense → W6QK Lad Contr OfficeView Agency

NAICS

332999 - All Other Miscellaneous Fabricated Metal Product ManufacturingView NAICS

Place of Performance

Chambersburg, PA, USA

Set-Aside

SBA

Documents

This scope was carved out of W911N226QA063.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

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Fabrication of Door Subassemblies

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Timeline

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subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → W6QK Lad Contr Office
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → W6QK Lad Contr Office
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Office AddressN/A
ContactsNo contact information available

Full Description

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Performs structural bonding of sub-components for prime contractors on Department of the Army door subassembly projects. Applies epoxy adhesive bonding in accordance with MIS-21030 standards using precision curing equipment and ovens. Requires adherence to MIS-21030 specifications. Delivers bonded door subassembly components.

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