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ESD/EMI-Safe Packaging and Kitting

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract with the Department of Defense, specifically the ASC Supplier Oper OEM Division, involves the design and supply of protective packaging for semiconductor components. The project requires the use of materials compliant with MIL-PRF-81705 standards to ensure effective electrostatic discharge and electromagnetic interference protection. The work will be performed at Hill AFB in zip code 84056-5734 under NAICS code 322299. Interested parties must submit their responses by August 20, 2026, following the posting date of August 12, 2026.

General Info

DoD subcontract for semiconductor protective packaging at Hill AFB, due August 20, 2026.

Agency

Department Of Defense → ASC SUPPLIER OPER OEM DIVISIONView Agency

NAICS

322299 - All Other Converted Paper Product ManufacturingView NAICS

Place of Performance

HILL AFB, UT, 84056-5734, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE4A5-26-T-349R.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVICE S

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Timeline

Posted

subcontract

Response Deadline

Submission deadline

Response Deadline

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Organization & Contact Information

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AgencyDepartment Of Defense → ASC SUPPLIER OPER OEM DIVISION
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → ASC SUPPLIER OPER OEM DIVISION
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Design and supply of electrostatic discharge (ESD) and electromagnetic interference (EMI) protective packaging using MIL-PRF-81705 compliant materials for semiconductor components.

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Same NAICS industry code

NAICS: 322299
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Physical Services

POSTED

5 months ago

DEADLINE

N/A
View Details

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