Fifteen (15) TickDev Rev2 PCBs
Contract Overview
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AI Contract Overview
The Defense Microelectronics Activity within the Department of Defense has awarded a follow-on order to Out of the Box Manufacturing LLC for the production of fifteen custom TickDev Rev2 Printed Circuit Boards. This procurement, identified by solicitation number HQ0727QSJ0002, was executed as a Firm Fixed Price Blanket Purchase Agreement call under NAICS code 334418. The award was made using a sole source justification dated September 1, 2026, in accordance with FAR 6.103-1, with the intent to gather vendor-specific past performance data to support future best-value procurement decisions. The contract is managed by the office located in McClellan, California, with the actual place of performance situated in Renton, Washington. Shon Jessup serves as the primary point of contact for this requirement. The action ensures the delivery of specialized hardware components necessary for the TickDev Rev2 requirement through an established BPA holder.
General Info
Place of Performance
Renton, WA, 98057, USASet-Aside
Documents
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Full Description
The Defense Microelectronics Activity (DMEA) has awarded a follow-on order for fifteen (15) custom Printed Circuit Boards (PCBs) for the TickDev Rev2 requirement to an established Blanket Purchase Agreement (BPA) holder.
Please see attached sole source documentation.
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