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This Government Contract opportunity from Department Of Defense was posted on June 23, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Final Assembly and Quality Assurance of Enclosures

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 332999
New
DIBBS
SPACER, RING
Solicitation # SPE4A7-26-T-560G
The contract pertains to the procurement of four SPACER, RING items with NSN 5365-12-391-8718 and part number 6459264 from RENK SYSTEMS CORP, under solicitation SPE4A7-26-T-560G. The delivery is set for 141 days after award, with FOB origin terms and no tolerance for quantity variance. All items must be inspected and accepted at the destination, and they must be packaged in compliance with ASTM D3951, with packaging and labeling conforming strictly to MIL-STD-129 and DLA’s RP001 packaging requirements, which supersede any conflicting standards. Sampling and quality verification are governed by MIL-STD-1916 or ASQ H1331, Table 1, with zero non-conformances required unless otherwise stated; critical, major, and minor attributes must be verified at levels VII, IV, and II respectively or with corresponding AQLs of 0.1, 1.0, and 4.0, while unspecified attributes are treated as major. The items must be palletized per DLA requirements and marked per RQ017 for physical identification. All technical and quality requirements referenced by R or I numbers are drawn from the DLA Master List of Technical and Quality Requirements, and the contract mandates removal of government identification from non-accepted supplies per RQ011. The delivery address is the DLA Distribution facility in New Cumberland, Pennsylvania, with the required ship date set for December 5, 2026. The unit price is $4.00 per unit, resulting in a total contract value of $16.00.
ASC SUPPLIER OPER AE AND AF DIV

POSTED

about 18 hours ago

DEADLINE

in 4 days

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The contract titled Final Assembly and Quality Assurance of Enclosures requires the assembly of enclosure components and the execution of final inspection, testing, and packaging activities within a controlled environment. All work must adhere to stringent quality standards to ensure product integrity and compliance with defense-grade specifications. The performance location is specified as zip code 95652, indicating the work will be conducted in a designated facility with environmental controls necessary for sensitive hardware handling. This is a subcontract under the NAICS code 332999, which covers other fabricated metal product manufacturing, and is issued by the Defense Microelectronics Activity under the Department of Defense. The opportunity was posted on June 23, 2026, with a response deadline of July 4, 2026, offering a narrow window for interested parties to submit proposals. No set-aside designation is applicable, and no point of contact information is provided in the data, suggesting submissions must follow standard federal subcontract protocols for the Defense Microelectronics Activity.

General Info

Final assembly and QA of enclosures at 95652 per defense standards under DMEA subcontract.

Agency

Department Of Defense → Defense Microelectronics ActivityView Agency

NAICS

332999 - All Other Miscellaneous Fabricated Metal Product ManufacturingView NAICS

Place of Performance

CA, 95652, USA

Set-Aside

NONE

Documents

This scope was carved out of HQ072726SCB01.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Case Re-Manufacturing

AI Contract Breakdown

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Microelectronics Activity
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Defense Microelectronics Activity
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Assemble enclosure components and conduct final inspection, testing, and packaging in a controlled environment.

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The Cable Connector Enhancement solicitation, numbered DME26TZ05-NP001 and issued by the Defense Microelectronics Activity under the Department of Defense, seeks an innovative and versatile solution to address failure-prone cable-to-board connections in electronics systems. Current methods, such as potting or Hot Bar Soldering, are often limited by mechanical constraints, high rework risks, or the need for assembly-specific tooling. The goal is to develop a more efficient method for maintaining reliable electrical connections in stressful environments, particularly for existing designs where full board redesigns are cost-prohibitive. This effort is structured as a Small Business Technology Transfer (STTR) program, set aside for total small businesses with fewer than 500 employees. The procurement process follows a trade-off basis, evaluating proposals based on technical merit, the qualifications of key personnel, and commercialization potential. Phase I typically lasts 6 to 12 months, with a potential transition to a 24-month Phase II. Proposals must be submitted via the Defense SBIR/STTR Internet Portal by September 23, 2026. Requirements include strict adherence to Cybersecurity Maturity Model Certification (CMMC) standards, full disclosure of foreign affiliations, and compliance with ITAR/EAR export controls. Awarded contracts will utilize Wide Area WorkFlow for invoicing and are subject to government inspection and acceptance at the destination.
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NAICS: 334418
SBIR / STTR
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Solicitation # DME26BZ05-NV001
The Defense Microelectronics Activity, under the Department of Defense, is soliciting Phase I feasibility studies for additive manufacturing of flexible electronics to support high-mix, low-volume manufacturing. The objective is to validate 3D printing methods for electronics packaging and assembly, specifically targeting the development of prototypes comparable to Radio Frequency multichip modules. Key technical goals include achieving printed trace widths of 5 mil or better, supporting 12x12 BGA with 0.5mm ball pitch, and ensuring thermal resilience up to 150 degrees Celsius. The effort seeks to reduce costs and manufacturing timelines by utilizing vat photopolymerization, aerosol jet printing, and integrated printed passives while establishing reliability data based on MIL-STD quality metrics. This solicitation, numbered DME26BZ05-NV001, is a total small business set-aside under NAICS code 334418, with a response deadline of September 23, 2026. Proposals must be submitted via the Defense SBIR/STTR Innovation Portal and are evaluated based on technical merit, investigator qualifications, and commercialization potential using a trade-off process. Awardees must comply with strict cybersecurity requirements, including CMMC Level 2 certification and NIST SP 800-172 standards. The contract is structured as a fixed-price research and development effort, requiring detailed technical and cost volumes, full disclosure of foreign affiliations, and adherence to specific small business work-performance percentages.
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