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This Sources Sought opportunity from Department Of Defense was posted on June 1, 2021. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Flex Printed Wiring Board Assemblies for Tobyhanna Army Depot

Closed
W25G1V108100W5Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418
New
NRP,PRINTE DBRD ASS — 5998016636129 — N0038327QSA01
Solicitation # N0038327QSA01
Solicitation N00383-27-Q-SA01, issued by NAVSUP Weapon Systems Support, is a small business set-aside for the teardown, evaluation, repair, overhaul, and modification of eight NRP Printed Board Assemblies (NSN 5998-01-663-6129, Part Number 8430022-502). The primary objective is to return these units to a Ready for Issue (RFI) condition within a 90-day delivery period. The work is to be performed at the CAES Systems LLC facility in Lansdale, Pennsylvania, and will be issued as a delivery order under BOA N00383-25-G-NP01. The contractor is responsible for providing all necessary labor, materials, and tooling, with strict prohibitions against part cannibalization unless specifically approved. The contract mandates adherence to ISO 9001 or SAE AS9100 quality systems and ANSI/NCSL Z540.3 or ISO-10012-1 calibration standards. Key administrative requirements include mandatory reporting via the Commercial Asset Visibility Repairables Portal and strict packaging compliance with MIL-STD-2073 and MIL-STD-129. The government will award the contract to a single responsible offeror based on a best-value determination, prioritizing past performance over price. Special provisions are included for Beyond Economical Repair (BER) determinations, Missing on Induction (MOI) components, and Over and Above Repair (OAR) efforts, all of which require written concurrence from DCMA and the Procuring Contracting Officer.
Navsup Weapon Systems Support

POSTED

1 day ago

DEADLINE

in 10 days

General Info

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

PA, USA

Set-Aside

NONE

Documents

0

No documents available

Documents will appear here when they are available.

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Timeline

PhaseClosed
Posted

Sources Sought

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → W0ML USA Deputy Tobyhanna
Contacts2 people available
OfficeTOBYHANNA, PA, 18466-5079, USA
Office AddressTOBYHANNA, PA, 18466-5079, USA
Contacts
Kristi-Jo M. Noel
Stephanie Coleman

Full Description

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Flex Printed Wiring Board (PWB) Assemblies for Tobyhanna Army Depot This is published as a sole source announcement under the statutory authority, 10 U.S.C. 2304(c)(1) as implemented by FAR 6.302-1, Only One Responsible Source and No Other Supplies or Services Will Satisfy Agency Requirements. The Army Contracting Command, Aberdeen Proving Ground, Tobyhanna Division, Tobyhanna Army Depot (TYAD), Tobyhanna, PA 18466 intends to negotiate and award a firm-fixed-price contract on a sole source basis to Cirexx International, Inc., 791 Nuttman Street, Santa Clara, CA 95054. The requirement is for TYAD to acquire the following: 215 each, Flex PWB Assembly, Part Number 10998D0105 274 each, Flex PWB Assembly, Part Number TRC-01977-106 274 each, Flex PWB Assembly, Part Number TRC-01977-107 Cirexx International, Inc. is the only known supplier with the proprietary data, design details, parts list and specific procedures to manufacture and test these parts. The Government does not have a Technical Data Package (TDP) suitable for competition for this requirement. This notice of intent is not a request for competitive proposals. A determination by the Government not to compete this requirement based on this notice is solely within the discretion of the Government. Any responsible firms believing they can provide the required Flex PWB Assemblies should, within ten (10) days of this notice, contact in writing the Contract Specialist identified below and submit a capability statement describing their firm's capability to meet the Government's requirement which will be reviewed for consideration. The NAICS code is 334418 and the size standard is 750 employees. The point of contact for this action is Kristi-Jo Noel, Contract Specialist. Email: Kristi-jo.m.noel.civ@mail.mil. This notice does not constitute a solicitation and shall not be construed as a commitment by the Government. Responses in any form are not offers and the Government is under no obligation to award a contract as a result of this announcement. No funds are available to pay for preparation of responses to this announcement. Any information submitted by respondents to this notice is strictly voluntary.

More opportunities from Department Of Defense → W0ML USA Deputy Tobyhanna

Same awarding agency

NAICS: 334413
Federal
Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2)
Solicitation # MicroelectronicsSourcingforTYAD2
The U.S. Army Contracting Command and Tobyhanna Army Depot are conducting market research through a Request for Information to identify qualified Original Component Manufacturers and Tier-1 direct distributors capable of supplying commercial-off-the-shelf, industrial, and defense-grade microelectronics. The primary goal is to move away from decentralized, broker-dependent procurement toward resilient, long-term direct relationships to support Circuit Card Assembly integration. The government is seeking partners who can sustain large-scale production volumes, ranging from hundreds of thousands to multi-million-unit annual runs, while maintaining vendor-managed inventory and the ability to handle rapid demand surges. To ensure supply chain integrity and anti-counterfeiting, the government requires strict provenance tracing from raw silicon and wafer fabrication through assembly and testing. Compliance with DoDI 5200.50, DFARS 252.246-7007/7008, and quality systems such as ISO 9001, AS9100, or IATF 16949 is essential, with AEC-Q200 qualification preferred for multilayer ceramic capacitors. Interested respondents must submit a capability package by October 27, 2026, detailing their corporate profile, supply tier classification, and manufacturing capacity. This RFI is for planning purposes only and does not constitute a formal solicitation or obligation for contract award.
Semiconductor and Related Device Manufacturing

POSTED

13 days ago

DEADLINE

in 6 days
View Details

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