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High-Precision Aluminum Nitride (AlN) Circuit Board Fabrication

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Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract calls for the manufacture of custom aluminum nitride circuit boards with a coefficient of thermal expansion no greater than 4 ppm/°C to ensure precise thermal compatibility with silicon carbide sensors. Production must strictly follow government-furnished drawings and be conducted in a controlled cleanroom environment to maintain the high standards required for aerospace applications. The work is being procured as a subcontract under NASA Shared Services Center on behalf of the National Aeronautics and Space Administration, with performance centered in Cleveland, Ohio, at the 44135 zip code location. The solicitation was posted to SAM gov on June 26, 2026, with a firm response deadline of June 30, 2026, at 12:00 PM. The North American Industry Classification System code for this procurement is 334418, indicating it involves the manufacturing of electronic components and related products, specifically targeting advanced ceramic substrates for high-reliability systems.

General Info

Manufacture custom aluminum nitride circuit boards with ≤4 ppm/°C CTE for NASA in Cleveland under strict cleanroom conditions.

Agency

National Aeronautics And Space Administration → NASA Shared Services CenterView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing View NAICS

Place of Performance

Cleveland, OH, 44135, USA

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NONE

Documents

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Timeline

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Organization & Contact Information

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AgencyNational Aeronautics And Space Administration → NASA Shared Services Center
ContactsNo contacts available
OfficeN/A
Organization / Agency
National Aeronautics And Space Administration → NASA Shared Services Center
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Office AddressN/A
ContactsNo contact information available

Full Description

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Manufacture of custom aluminum nitride (AlN) circuit boards with CTE ≤4 ppm/°C for compatibility with SiC sensors, using government-furnished drawings and cleanroom processes.

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