This Government Contract opportunity from National Aeronautics And Space Administration was posted on June 26, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
High-Precision Aluminum Nitride (AlN) Circuit Board Fabrication
Contract Overview
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The contract calls for the manufacture of custom aluminum nitride circuit boards with a coefficient of thermal expansion no greater than 4 ppm/°C to ensure precise thermal compatibility with silicon carbide sensors. Production must strictly follow government-furnished drawings and be conducted in a controlled cleanroom environment to maintain the high standards required for aerospace applications. The work is being procured as a subcontract under NASA Shared Services Center on behalf of the National Aeronautics and Space Administration, with performance centered in Cleveland, Ohio, at the 44135 zip code location. The solicitation was posted to SAM gov on June 26, 2026, with a firm response deadline of June 30, 2026, at 12:00 PM. The North American Industry Classification System code for this procurement is 334418, indicating it involves the manufacturing of electronic components and related products, specifically targeting advanced ceramic substrates for high-reliability systems.
General Info
Agency
NAICS
Place of Performance
Cleveland, OH, 44135, USASet-Aside
Documents
This scope was carved out of 80NSSC26936730Q.
The full solicitation package (3 documents), including the RFP, is on the prime solicitation, not on this scope.
Multichip Module Package for SiC Pressure Sensors
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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