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High-Speed Data Acquisition (DAQ) Hardware/Firmware

Active

SBIR / STTR

Response Deadline10/28/2026, 04:00:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

General Info

Agency

Department of Defense → United States Air Force

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

Not specified

Set-Aside

SBA

Documents

This scope was carved out of DAF27BZ06-NV006.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

High Speed, Low Temperature Hyperspectral Imager for High Enthalpy Ground Testing

AI Contract Breakdown

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Timeline

PostedOct 7

subcontract

Response DeadlineOct 28

Submission deadline

Response Deadline

10/28/2026, 04:00:00 AM UTCin 19 days

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Organization & Contact Information

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AgencyDepartment of Defense → United States Air Force

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment of Defense → United States Air Force

Office AddressN/A

ContactsNo contact information available

Full Description

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Supplies high-speed electronics and firmware for prime contractors on US Air Force Arnold Engineering Development Complex projects. Provides high-speed FPGA boards, data acquisition cards, or custom firmware to capture and process imaging data at sampling rates of 4000 Hz to 5000 Hz. Must be compliant with ITAR/EAR regulations. Delivers DAQ hardware or embedded firmware.

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