This Government Contract opportunity from National Aeronautics And Space Administration was posted on June 30, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
High-Temperature Ohmic Contact Metallization Development
Contract Overview
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The contract seeks the design, materials selection, and fabrication of stable ohmic contacts on AlGaN/GaN substrates capable of operating at 800°C in ambient air for a minimum of one hour without degradation. The work must ensure reliable electrical performance under extreme thermal conditions, requiring innovative metallization schemes that resist oxidation, interdiffusion, and delamination at high temperatures. Successful development will enable long-term functionality in high-temperature environments typically encountered in aerospace and sensor applications. The opportunity is posted as a subcontract under NASA Shared Services Center with a NAICS code of 334418, indicating focus on semiconductor and related device manufacturing. The solicitation was posted on June 30, 2026, with a response deadline of July 2, 2026, at 9:00 PM Eastern Time. Performance is expected to take place in Cleveland, Ohio, with a zip code of 44135. There is no set-aside designation, and no point of contact is provided, suggesting proposers must rely on the public solicitation link for further details.
General Info
Agency
NAICS
Place of Performance
Cleveland, OH, 44135, USASet-Aside
Documents
This scope was carved out of 80NSSC26936838Q.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
Contact Metallization for High-Temperature GaN Amplifiers
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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