High-Temperature Packaging and Thermal Management Solutions

The contract seeks innovative packaging solutions capable of maintaining thermal stability up to 800°C under air exposure conditions, focusing on critical components such as die attach materials, substrates, and encapsulation systems. These solutions must enable reliable operation in extreme thermal environments typical of advanced aerospace and spaceflight applications, with a requirement for full compatibility with ambient air exposure without degradation. The scope emphasizes the development or supply of materials and structures that can endure sustained high temperatures while preserving electrical and mechanical integrity. This subcontract, issued by the NASA Shared Services Center on behalf of the National Aeronautics and Space Administration, is classified under NAICS code 335999 for other electrical equipment and component manufacturing. Interested parties must submit responses by July 2, 2026, at 1:00 PM, with the posting date listed as June 29, 2026. No set-aside type is specified, and details regarding the place of performance or point of contact are not provided. The opportunity is open to qualified contractors capable of delivering cutting-edge thermal management technologies for mission-critical space systems.