This Combined Synopsis/Solicitation opportunity from Department Of Commerce was posted on July 16, 2019. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Highly Uniform Device Layer Thickness Silicon-on-Insulator Wafers
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The National Institute of Standards and Technology is soliciting quotations for the procurement of 20 highly uniform Silicon-on-Insulator wafers to support the development of a Reference Material for calibrating 3D microscopes and optical profilometry tools. To ensure the necessary precision in the z-direction, the wafers must feature device layer thickness uniformity better than 2 percent, specifically requiring the SmartCut process or an equivalent for thin layers between 1.5 and 2 micrometers. This acquisition is being conducted as an unrestricted full and open competition under FAR Part 13 Simplified Acquisition Procedures, with the associated NAICS code 334413. The government will award a purchase order to the responsible quoter offering the lowest price that is deemed technically acceptable based on the ability to meet all minimum specifications. Successful contractors must deliver the items F.O.B. Destination to Gaithersburg, Maryland, within eight weeks of the award date. Payment will be issued following government acceptance, and advance or partial payments are not authorized. Required submissions include firm-fixed price quotations, technical documentation demonstrating compliance with specifications, an active SAM registration, and completed solicitation provisions.
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