HT In-situ Indenter

The HT In-situ Indenter project, managed by the Department of Commerce Office of the Director, focuses on addressing manufacturing challenges related to thermal management and mechanical incompatibilities in the heterogeneous integration of modular chips within system-in-package designs. The initiative aims to utilize indentation and scanning probe-based measurements to analyze process-induced alterations in the thermo-mechanical properties of materials and structures used in advanced packaging. By leveraging extensive expertise in nanoscale and microscale mechanical property measurements, the project will develop and deliver improved measurement methodologies and critical data to industry partners. This effort is intended to enhance predictive manufacturing capabilities and is slated for performance in Gaithersburg, Maryland, under NAICS code 334413.