Hub Operations Option Year 3 (OY3)

MEC: Revision 4 and Attachment M: Consolidation Summary Updated Please find the latest revision of OY3 under key documents. The Government has also provided an additional document – Attachment M: Consolidation Summary – that can also be found under Key Documents. Q&A Responses and Attachment J. TDD Hub Ops Guidance – 8 May 2026 NSTXL has posted the Q&A Responses for review. An update to remove a statement in Attachment J. TDD Hub Guidance has been made and is reflected in the Q&A Response Document. Revised OY3 Documents and Attachments – 28 April 2026 Additional Updates to OY3 Guidance are being provided to Commons Hubs. Please see the OY3 Key Documents section for updated materials and guidance. The deadline for questions has been extended to close of business 01 May 2026. Proposal Questions & Support For all questions related to proposal preparation, submission requirements, or portal access, please contact the Commons Proposals Team at commonsproposals@nstxl.org . To ensure timely support and coordination, hubs should direct all proposer inquiries to this centralized mailbox rather than individual NSTXL staff. This allows the team to track, triage, and respond to questions consistently across all hubs. Project Background The Microelectronics Commons, a national network funded by the CHIPS and Science Act, is dedicated to onshore microelectronics hardware prototyping, accelerating the transition of semiconductor technologies from laboratory to fabrication (lab-to-fab), and semiconductor workforce training. The Commons plays a crucial role in complementing other CHIPS initiatives, such as the National Semiconductor Technology Center (NSTC), by providing the necessary physical, digital, and human infrastructure for microelectronics prototyping across six critical technology areas for the Department of War (DoW). These areas include: 5G/6G Technology, Artificial Intelligence (AI) Hardware, Commercial Leap Ahead Technologies, Electromagnetic Warfare, Quantum Technology, and Secure Edge/IoT Computing. By fostering collaboration among key regional entities, the Commons has successfully established a vibrant ecosystem for lab-to-fab prototyping, addressing significant challenges in microelectronics hardware. The initial phase of this initiative, supported by previous Requests for Solutions (RFS), Microelectronics Commons Project No. 22-16 (Ref a) and 22-16-03 (Ref b), has laid a robust foundation for the Hub ecosystem, its infrastructure, operational processes, and workforce development (WFD) programs. As the Microelectronics Commons transitions into its next phase, the focus is ensuring long-term sustainability of Hub operations and workforce development initiatives beyond Fiscal Year 2028 (FY28). This new RFS seeks innovative solutions that will build upon the established framework to create a sustainable, resilient, and continuously evolving ecosystem. The goal is to solidify the Commons as a lasting national asset for both government and commercial prototyping needs, securing fertile ground for future innovation and onshore manufacturing, thereby reinforcing national economic and security objectives. Desired End-State As a continuation of previous Commons RFS’s (ref a and b), the program requests technical solutions for further maturation of the Commons Hub business model and how the Hub will become fully sustainable by the end of FY28. How To Submit Coming Soon – OY3 Submission Portal. NSTXL will update when the submission portal is live. Service area interests and capabilities can be found within the Microelectronics Commons Resource Library .