Integrated Circuit Design and Fabrication

NB687010-12-01057 - Integrated Circuit Design and Fabrication National Institute of Standards and Technology (NIST) Acquisition Management Division Sources Sought for Commercial Item Purchase The National Institute of Standards & Technology (NIST) seeks information on vendors that are capable of providing integrated circuits to be used in the development at NIST of a millimeter-wave large-signal network analyzer (LSNA). The circuits will be based on InP HBT or HEMT transistors, or similar technologies capable of producing power amplifiers with 50 mW of output power at 200 GHz and 10 mW at 300 GHz, and mixers, phase-locked loops, dynamic frequency dividers, and oscillators operating at frequencies of 50 GHz to 300 GHz. This announcement is not a Request for Proposals (RFP) and does not commit the Government to award a contract now or in the future. No solicitation is available at this time. The purpose of this synopsis is to identify organizations with the requisite qualifications to meet the requirements of the item stated herein. After results of this market research are obtained and analyzed and compared with NIST's minimum requirements (see attached document for Technical Specifications), NIST may conduct a competitive procurement and subsequently award a contract. If at least two qualified small businesses are identified during this market research stage, then this acquisition may be solicited as a small business set aside. NIST is seeking responses from all responsible sources, including large and small businesses (SB, SDB, WOSB, HUBZone, SDVOSB and VOSB). This requirement is assigned a NAICS code of 334413 - Semiconductor and Related Device Manufacturing, with a small business size standard for such requirements of 500 employees. The specific purpose of this Sources Sought Announcement is to determine if there are small businesses, within the parameters identified above, that are capable of providing the item identified in the attached Statement of Work. Interested business organizations that believe they are capable of meeting the requirement should submit electronic copies or mailed copies of their capability statement. Please limit responses to ten (10) pages or less. Responses should include the following information: 1. Name of company that will provide the design kit and consultation. 2. Name of company that will fabricate the integrated circuit. 3. Spec sheets and examples of prior provision of this type of service, addressing the criteria identified above and in the attached specifications. 4. Typical number of fabrication runs per year and typical time to deliver the die after tapeout date. 5. Any other relevant information that is not listed above which the Government should consider in developing its minimum specifications and finalizing its market research. Any proprietary information should be so marked. The written capability statement should be received by the Contracting Officer no later than February 20, 2012. The capability statement shall identify the business status of the organization. Only electronic or mailed statements will be accepted. Faxes will not be accepted. Send to Christine Rogge, Contract Specialist, at contact@example.gov. Direct all questions to this e-mail or to Leonard Spakow at contact@example.gov.