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This Government Contract opportunity from Department Of Defense was posted on June 28, 2022. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

KANAGAWA - Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output

Closed
N0016422SNB72Federal

Contract Overview

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General Info

NAICS

334413 - Semiconductor and Related Device Manufacturing

Place of Performance

IN

Set-Aside

NONE

Documents

0

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Timeline

PhaseClosed
Posted

special-notice

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Nswc Crane
Contacts2 people available
OfficeCRANE, IN, 47522-5001, USA
Office AddressCRANE, IN, 47522-5001, USA

Full Description

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Special Notice N0016422SNB72 Agency: Department of the Navy Office: Naval Sea Systems Command Location: NSWC Crane Division Classification Code: AC33 - National Defense R&D Services; Defense-Related Activities; Experimental Development NAICS Code: 334413 - Semiconductor and Related Device Manufacturing Response Due Date: 27 July 2022 Request for Solutions: KANAGAWA - Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output PURPOSE This Request for Solutions (RFS) is issued seeking to promote the maturation of Co-packaged optics (CPO) and demonstrate optical links with compelling performance to stimulate transition into the DoD advanced packaging ecosystem and the Defense Industrial Base (DIB). The Government will evaluate the solutions with the intent of awarding an Other Transaction Agreement (OTA) in accordance with 10 U.S. Code - 4022. BACKGROUND AND SUMMARY S2MARTS Vendors interested in responding to this RFS must be members of the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium. Interested parties may visit S2MARTS.org for membership information. This project will be managed by a Naval Surface Warfare Center, Crane Division Project Manager. PROJECT OVERVIEW Co-packaged optics (CPO), the integration of photonic integrated circuits (PIC) with electronic integrated circuits (EIC) inside multi-chip packages (MCP) enables long-reach and high-bandwidth data input/output (I/O), and offers to significantly expand the capabilities of defense microelectronics. For example, such technology can generate dramatically higher data rates from the field-programmable gate arrays (FPGA) that process digital beamforming signals, opening up the possibility of new phased array radar architectures. While the merits of CPO I/O have been well known for two decades, the technology is nascent and requires substantial maturation prior to adoption in DoD programs of record. Additionally, the manufacturing processes and supply chain for the photonic chips that comprise co-packaged optical modules is not well established, and demonstrations to date have relied on expensive, custom assembly that are not compatible with high-volume production. The KANAGAWA project aims to design, build, and test prototypes which demonstrate CPO, laser sources, and heterogeneous integration techniques with other electrical Integrated Circuits (ICs) (e.g., FPGAs, data converters). Secondly, KANAGAWA will strategically partner CPO designers with packaging facilities to assess and demonstrate the maturation of underlying manufacturing processes. By tailoring metrics from the DoD Manufacturing Readiness Level (MRL) Deskbook 2020, KANAGAWA will de-risk the transition of CPO I/O technology towards the DIB, while driving affordability and scalability for production. Please visit the S2MARTS website at https://s2marts.org/ to review the full RFS. Contracting Office Address: 300 Hwy 361 Crane, IN 47522 United States Primary Point of Contact.: ReBecca Poplin-Smith rebecca.r.poplin.civ@us.navy.mil Phone: 812-227-9363 Secondary Point of Contact: Jason Clark jason.j.clark26.civ@us.navy.mil Phone: 812-854-3320

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EVALUATION/REPAIRS
Solicitation # N00016427Q0006
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Commercial and Industrial Machinery and Equipment (except Automotive and Electronic) Repair and Maintenance

POSTED

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DEADLINE

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