Market and Packaging Technology Trends
Contract Overview
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The Department of Commerce is seeking a contractor to provide a corporate license for an annual subscription serving ten subscribers. This subscription must focus on the latest developments in packaging technologies, specifically covering Ball Grid arrays, Chip Scale Packages, Stacked Die CSPs, Flip Chip, Wafer Level Packages, substrates, chiplets, Co-design/EDA, and related equipment and processes. The agreement includes comprehensive requirements for customer support, installation, warranty, and training, with delivery terms set as FOB Destination. Performance for this contract will take place in Gaithersburg, and the procurement is categorized under NAICS code 519290.
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Place of Performance
GAITHERSBURG, MD, USASet-Aside
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