MARKET SURVEY: Replacement Driver Amplifier Substrate Assemblies and Output Amplifier Substrate Assemblies

THIS ORIGINAL MARKET SURVEY WAS POSTED ON THE FAA'S CONTRACTING OPPORTUNITIES WEBSITE (FAACO.FAA.GOV). IF YOU ARE VIEWING THIS FROM ANOTHER SOURCE, THE INFORMATION MAY NOT CONTAIN ALL PERTINENT INFORMATION. GENERAL INFORMATION: The Federal Aviation Administration (FAA), Mike Monroney Aeronautical Center (MMAC), is conducting a Market Survey to improve the Government’s understanding of the current marketplace and to identify qualified and capable sources. This announcement is not a Screening Information Request (SIR) or a Request for Offer (RFO) of any kind. The Federal Aviation Administration (FAA) has a requirement for the acquisition of replacement driver amplifier substrate assemblies and output amplifier substrate assemblies; both subassemblies are used inside the primary power amplifier for the Mode Select Beacon System (Mode S). The Mode S Beacon System is a combined secondary surveillance radar (beacon) and ground-air-ground data link system. Mode S provides positional information and minimizes interference. Mode S provides the medium for a digital data link which can be used to exchange information between aircraft and various air traffic control functions and weather databases. The primary power amplifier produces high power radio frequency (RF) pulses that are radiated in space through the antenna main directional beam (frequency of operation is 1030 MHz). The Government requires form-fit-functional replacement subassemblies that contain modern and available RF components; e.g., the RF transistor(s); that can replace the legacy units. The requirement is for a one-time fixed-price contract, with a first article delivery of two (2) units of each subassembly and ten (10) production units of each subassembly. The attached (DRAFT) Statement of Work (SOW) describes the following subassemblies of the Mode S primary power amplifier: *Driver amplifier substrate assembly (replacement for Westinghouse part number 1D21879G01) *Output amplifier substrate assembly (replacement for Westinghouse part number 1D21881G01) The acquisition strategy for this procurement has not been determined. The FAA intends to review all response submittals to establish the acquisition strategy. Responses to this market survey will be used to develop the Source List to be used when the solicitation for this requirement is issued, and will be used to determine if there is adequate competition to set the requirement aside for Small Business; or open it up for full and open competition. All interested sources need to respond to this market survey. The information identified from this market survey may result in a restricted screening process when the RFO is issued. Decisions will be made based on the information provided by vendors responding to this market survey. This survey is being conducted in accordance with FAA Acquisition Management System (AMS) Section 3.2.1.2.1. This survey will support market research obtained from multiple sources and will be utilized for planning purposes only. BACKGROUND The subassemblies must adhere to the configuration baselines as defined in the (DRAFT) Statement of Work. Westinghouse; now Northrop Grumman originally designed, developed, and manufactured the driver amplifier substrate assembly and output amplifier substrate assembly, which were procured by the FAA when the Mode S systems were initially fielded. The available specifications or drawings are provided with this market survey. The intent of this market survey is to permit companies that may possess the technical capabilities to meet requirements to manufacture Form-Fit-Function replacements for the driver amplifier substrate assembly and output amplifier substrate assembly an opportunity to provide specific information as to their unique capabilities as specified in this announcement. Qualified vendors will need to show capability to furnish all required labor, plant, materials, fixtures, equipment, tools, test equipment, technical data/expertise and all other facilities necessary to provide Form-Fit-Function replacements for the driver amplifier substrate assembly and output amplifier substrate assembly. RESPONSE TO THIS MARKET SURVEY: Any information provided in response to this market survey will be used for informational purposes only and will not be released. Any proprietary information submitted will be protected if appropriately marked. Vendor participation in any informational session is not a promise of future business with the FAA. Interested sources should provide evidence of qualifications/capabilities available to provide experienced qualified management and technical personnel to manufacture Form-Fit-Function replacements for the driver amplifier substrate assembly and output amplifier substrate assembly. The accompanying documents are intended to provide enough information for prospective companies/vendors to decide whether or not they are capable of providing Driver and Output Amplifier Assemblies that meet the Mode S system’s requirements. Interested vendors that have the capabilities to manufacture Driver and Output Amplifier Assemblies that meet the Mode S system’s requirements should provide sufficient information to describe those items and capabilities in a compelling manner. Submitted documentation must clearly demonstrate that the vendor can produce Driver and Output Amplifier Assemblies meeting the size, electrical (reflected power, output power (minimum and maximum), rise time, ability to tune the input and output matching circuit, etc. under specified test conditions), and military standards specified in the accompanying documents. In addition, the submitted documentation should address the following: *Vendor’s ability to provide two (2) each First Article Driver and Output Amplifier Assemblies within four (4) months after receipt of order. *Vendor’s ability to commence delivery of production Driver and Output Amplifier Assemblies within three (3) months of the FAA’s notice to proceed. Response submittals must include information for the following two (2) requests: 1. Vendor responses will describe the resources available to meet the description set forth in this market survey and provide documentation that clearly demonstrates that the interested vendor is qualified and capable manufacture Form-Fit-Function replacements for the driver amplifier substrate assembly and output amplifier substrate assembly. Documentation shall include ability to meet delivery requirements. The format of the documentation is at the discretion of the vendor. A short list of RF projects that the vendor has successfully designed and manufactured (emphasis on high power, high frequency RF amplification) can be submitted to demonstrate the capabilities that the vendor possesses in this area. 2. Completed and signed Business Declaration Form (attached) for descriptive information regarding the business status of the vendor. All response submittals (one response per company) are to be provided with a cover letter on company letterhead. Responses must be received no later than 3:00 P.M, local time November 12, 2014. Market survey responses received after the time and date specified may be determined to be late and may not be considered. All response submittals, including attachments, shall be submitted electronically to the following email address: contact@example.gov, Reference: Power Amp Subassemblies Market Survey. All interested vendors are advised that the FAA will not pay for any information or any administrative costs incurred that are associated with any response received from industry in response to this market survey. Therefore, any costs associated with vendor’s market survey submissions will be solely at the interested vendor’s expense. All FAA documents are to be downloaded and printed from the FAA Contracting Opportunities web site found at http://faaco.faa.gov (or by access through http://fast.faa.gov). Please note that documents downloaded from sites other than the FAA’s Contracting Opportunities web site may not be the latest documents. Only vendors that respond with information packages providing the required information demonstrating that their firm meets the minimum requirements will be added to the Source List for this requirement. NOTE: Any contract awarded for the requirements above will contain the AMS Clause 3.3.1-33 System for Award Management (August 2012). Award cannot be made to a vendor that has not accomplished this registration. See paragraph (d) of the clause below: ***(d) If the offeror does not become registered in the SAM database in the time prescribed by the Contracting Officer, the Contracting Officer may proceed to award to the next otherwise successful registered offeror. ATTACHMENTS: Business Declaration (to be completed by vendor and returned) (DRAFT) Statement of Work 1D21879G01.zip file 1D21881G01.zip file NOTICE for informational purposes for Minority, Women-owned and Disadvantaged Business Enterprises: The Department of Transportation (DOT), Office of Small and Disadvantaged Business Utilization (OSDBU), has a program to assist small businesses, small businesses owned and controlled by socially and economically disadvantaged individuals, and women-owned concerns to acquire short-term working capital assistance for transportation-related contracts. Loans are available under the DOT Short Term Lending Program (STLP) at prime interest rates to provide accounts receivable financing. The maximum line of credit is $500,000. For further information and applicable forms concerning STLP, call the OSDBU at +1 (555) 000-0000. If you're viewing this announcement from a source other than Federal Aviation Administration Contract Opportunities (FAACO), visit https://faaco.faa.gov/index.cfm/announcement/view/18438 to view the original announcement.