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MEMS-Based CO2 Sensor Fabrication

Active

Federal

Response Deadline09/08/2026, 02:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The Department of Veterans Affairs, through Rpo East, is seeking a subcontract for the microfabrication of CO2 sensor components utilizing MEMS technology. The scope of work focuses on wafer-level processing, thin-film deposition, and the batch production of sensor dies to ensure scalability and miniaturization of the devices. This opportunity was posted on August 24, 2026, with a response deadline of September 8, 2026. The project falls under NAICS code 334418, reflecting its focus on specialized semiconductor and sensor manufacturing.

General Info

VA Rpo East seeks MEMS microfabrication subcontract for CO2 sensor components by September 8.

Agency

Department Of Veterans Affairs → Rpo East (36C24E)View Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

PA

Set-Aside

NONE

Documents

This scope was carved out of 36C24E26Q0110.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

AN13--Intent to sole source - Miniaturized CO2 Sensor Prototype Development and Novel Physiologic Gas Monitoring Research

AI Contract Breakdown

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No contract breakdown available.

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Timeline

PostedAug 24

subcontract

Response DeadlineSep 8

Submission deadline

Response Deadline

09/08/2026, 02:00:00 PM UTCin 7 days

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Organization & Contact Information

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AgencyDepartment Of Veterans Affairs → Rpo East (36C24E)

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Veterans Affairs → Rpo East (36C24E)

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Microfabrication of CO2 sensor components using MEMS technology, including wafer-level processing, thin-film deposition, and batch production of sensor dies for scalability and miniaturization.

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