This Government Contract opportunity from Department Of Defense was posted on July 20, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
MIL-STD-2073-1E Compliant Packaging
Contract Overview
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AI Contract Overview
The contract requires the design and execution of military-grade packaging for sensitive electronics in full compliance with MIL-STD-2073-1E standards, ensuring robust protection against environmental stressors, shock, vibration, and electrostatic discharge. The packaging must incorporate specialized ESD protection and cushioning systems to safeguard critical electronic components throughout transit and storage, meeting stringent Department of Defense performance criteria for durability and reliability. All work must adhere to approved methodologies and materials that guarantee compatibility with military logistics and handling protocols. This is a subcontract opportunity issued by the ACTIVE DEVICES DIVISION under the Department of Defense, with performance required in Columbus, Ohio, at a ZIP code of 43213. The solicitation was posted on July 20, 2026, with a response deadline of July 31, 2026, and falls under NAICS code 323113, indicating it targets printing and related support activities. The contract is open to qualified subcontractors capable of delivering certified packaging solutions, with no set-aside classification specified, and all proposals must be submitted through the DIBBS platform using the provided link.
General Info
Agency
NAICS
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-336X.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, DIGITAL
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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